Onto Innovation

Scaling the Future of Wide Bandgap | Manufacturing, Standardization, and Global Readiness One of the most critical conversations at I.S.E.S. USA Power 2025 centered on the manufacturability, scalability, and supply chain readiness of SiC and GaN—technologies that sit at the heart of next-generation electrification. Moderated by Dr. Mike Rosa, CMO & SVP Strategy at Onto Innovation, this powerhouse panel tackled the toughest questions in wide bandgap (WBG) commercialization: 🔹 Dr. Primit Parikh, VP GaN, Renesas Electronics 🔹 Dr. Victor Veliadis, Executive Director & CTO, PowerAmerica 🔹 Dr. Shiori IDAKA, Head of ERC Semiconductor, Mitsubishi Electric Corporation 🔹 Dr. Rainer Kaesmaier, Managing Director Semiconductors, Hitachi Energy 🔹 Gianni Vitale, Application Director, STMicroelectronics From fab readiness and toolchain compatibility to the need for robust metrology, global collaboration, and design-for-manufacturing approaches—the discussion reinforced that scalability isn't just a materials challenge; it’s a systems and strategy imperative. Whether for electric vehicles, smart grid systems, or AI infrastructure, wide bandgap adoption depends on how quickly and collaboratively we solve for manufacturability and cost at scale. #ISESUSAPower2025 #WBG #SiC #GaN #Manufacturability #PowerSemiconductors #Electrification #theISIG #Connect #Collaborate #Community Jubed Miah, Salah Nasri, Kevin Dei, Justine MASSIP, Mia Chen, Ellen Wendelin Loh, Elsa Medin, Michelle Yan

🌟 Onto Innovation is delighted to present our fifth annual ESG report, showcasing the progress we made in 2024 and our ongoing commitment to these programs for the good of our stakeholders. 🌍 Throughout 2024, we remained committed to lowering greenhouse gas emissions and our carbon footprint, while building strong teams that benefit from diversity in the workplace. In 2024, we have surpassed all our 2025 environmental goals, reducing our overall environmental impact by more than the targeted 30% ahead of schedule. By the end of 2024, we had reduced our carbon footprint per person by 51% and increased our renewable energy usage to 41% of total electrical consumption. 🤝 We believe our innovative approaches, particularly in assisting our customers with their environmental goals and fostering internal initiatives, are key to building broader engagement within Onto Innovation and strengthening our connections with local communities. The successes of 2024 are a testament to the collective efforts of our global team. 📖 To learn more about our commitment to environmental stewardship, workforce diversity, and robust governance, please read this ESG report: https://lnkd.in/egvBGZrj.

Packaging is power—literally. Our first panel of Day 1 at I.S.E.S. USA 2025 set the tone for the future: "Evolving Trends for Advanced Packaging and the Challenges for Supply Chain and End User Applications" explored how advanced packaging is no longer just about form factor—it’s about unlocking performance per watt, thermal efficiency, and AI-readiness at scale. 🔹 Moderated by Dr. Monita Pau, Strategic Marketing Director, Advanced Packaging at Onto Innovation, the session brought together trailblazers from across the semiconductor spectrum: • Dr. Vincent Woopoung Kim, Head of DSRA-PKG, Samsung Electronics • Dr. Jaesik Lee, VP Package Engineering, SK hynix America • Dr. Raja Swaminathan, CVP, Advanced Packaging, AMD • Bassel Haddad, SVP & GM, Advanced Packaging, SkyWater Technology From silicon scaling to power-optimized architectures, this discussion highlighted how packaging is fast becoming the critical performance lever in the AI and HPC era. Stay tuned for more updates happening at the Plug and Play Tech Center. #ISESUSA2025 #theISIG #Connect #Collaborate #Community #AdvancedPackaging #Semiconductors #AI #HPC #PowerEfficiency #TechLeadership #Innovation #AMD #Samsung #SKHynix #SkyWater #OntoInnovation Jubed Miah, Salah Nasri, Kevin Dei, Mia Chen, Ellen Wendelin Loh, Elsa Medin, Michelle Yan

Thoroughly enjoyed the conversations I had and the responses that industry experts provided. In the semiconductor industry we can be so enamoured with the teeny tiny that we forget that big defects occur. And sometimes with significant yield loss. Thanks to John Wall of Bruker Technologies Ltd Steve Zamek of PDF Solutions, Reiner Fenske of Microtronic Inc., Woo Young Han of Onto Innovation and Jin Yu, PhD of Teradyne

Up next: 'Optimising opportunities for SiC success' ⚡ As sales of electric vehicles stutter, SiC revenues could face some bumps in the road ahead. So, what’s the best approach to optimising returns in these uncertain times? Speakers include: 🔹 Llew Vaughan-Edmunds - Navitas Semiconductor - '20 Years of SiC Innovation Leadership: Trench-Assisted Planar Gate Technology' 🔹 David Britz - Applied Materials - 'Solving Challenges in Compound Semiconductors: An Equipment Supplier’s Perspective' 🔹 Peter Friedrichs - Infineon Technologies - 'Building the World’s Most Cost-efficient SiC Fab' 🔹 Bernhard Hammerl - Siconnex - 'Integrated Metal Etch and Photoresist Strip Solution for SiC Manufacturing' 🔹 Mike Rosa - Onto Innovation - 'High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies' 🔹 Alessandro Rossi - SCREEN Semiconductor Solutions Co., Ltd. - 'SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Wafer Inspection and Thickness Measurement Tools and HVM experience' Make sure to attend these presentations for exclusive insights from industry experts! Take a look at the CS International Conference agenda here 👉 https://lnkd.in/eHMMZXU #CSInternationalConference #CSInternational #compoundsemiconductor #AngelTech

Why Thin Film Measurements Matter Controlling thin films to precise specifications is essential for ensuring high yield in high-performance devices. By Laura Peters. https://lnkd.in/g7sWygkC #semiconductor #thinfilms #metrology #processcontrol #TSVs #2nm #3nm #inspection Jiangtao Hu Onto Innovation Juliette Vandermeer Bruker Nano Surfaces & Metrology KLA Bruker Tignis Boyd F.

APC|M Europe runs April 8-10 in Prague, and the Onto Innovation team will there to discuss our unique lineup of process control solutions enabling our customers to meet today’s challenges without sacrificing throughput. To learn more about Onto, please visit: [link]. For more on APC|M Europe, please visit: [visit].

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📣Proud to announce that LPKF Laser & Electronics SE joined Onto Innovation's Packaging Applications Center of Excellence (PACE). PACE aims to develop seamless process integration and a secure supply chain to accelerate mass production of panel-level packages based on glass cores. These have become essential in the semiconductor architecture to meet the needs of demanding end applications like high-performance computing (#HPC), artificial intelligence (#AI), cloud computing and machine/deep learning 🦾 How we change glass based panel-level packaging together🚀 LPKF’s LIDE technology excels in micro-processing defect-free through glass vias (TGV) for advanced glass substrates. Onto Innovation’s Firefly system provides an automated inspection and metrology solution for advanced IC substrates and panel level packaging. Read more: https://lnkd.in/eQVMPaBS #semiconductor #AdvancedPackaging #GlassPackaging #innovation

Remote integration, tight deadlines, and a global pandemic—challenge accepted! 🤝 In 2020, Onto Innovation set out to integrate a new GEM300 metrology tool into an automated production line. With tight deadlines, COVID-related constraints, and the complexity of GEM300, they took on the challenge with determination. To support them, Agileo Automation brought its expertise in digital twins and GEM300 connectivity, making remote integration possible. By working closely across time zones, we ran simulations, supervised real-time operations with video support, and ensured a smooth acceptance process. Thanks to Onto Innovation’s trust and agility, and our team’s commitment, we delivered the project on time, with full functionality—proving that great collaboration knows no boundaries 🙏 Proud to have partnered with Onto Innovation on this achievement! #GEM300 #DigitalTwin #Semiconductor #Automation #IndustrialAutomation #SECSGEM Olivier Vittu Alexis GRANGER Maxence DRAUD