Onto Innovation

Packaging is power—literally. Our first panel of Day 1 at I.S.E.S. USA 2025 set the tone for the future: "Evolving Trends for Advanced Packaging and the Challenges for Supply Chain and End User Applications" explored how advanced packaging is no longer just about form factor—it’s about unlocking performance per watt, thermal efficiency, and AI-readiness at scale. 🔹 Moderated by Dr. Monita Pau, Strategic Marketing Director, Advanced Packaging at Onto Innovation, the session brought together trailblazers from across the semiconductor spectrum: • Dr. Vincent Woopoung Kim, Head of DSRA-PKG, Samsung Electronics • Dr. Jaesik Lee, VP Package Engineering, SK hynix America • Dr. Raja Swaminathan, CVP, Advanced Packaging, AMD • Bassel Haddad, SVP & GM, Advanced Packaging, SkyWater Technology From silicon scaling to power-optimized architectures, this discussion highlighted how packaging is fast becoming the critical performance lever in the AI and HPC era. Stay tuned for more updates happening at the Plug and Play Tech Center. #ISESUSA2025 #theISIG #Connect #Collaborate #Community #AdvancedPackaging #Semiconductors #AI #HPC #PowerEfficiency #TechLeadership #Innovation #AMD #Samsung #SKHynix #SkyWater #OntoInnovation Jubed Miah, Salah Nasri, Kevin Dei, Mia Chen, Ellen Wendelin Loh, Elsa Medin, Michelle Yan

Thoroughly enjoyed the conversations I had and the responses that industry experts provided. In the semiconductor industry we can be so enamoured with the teeny tiny that we forget that big defects occur. And sometimes with significant yield loss. Thanks to John Wall of Bruker Technologies Ltd Steve Zamek of PDF Solutions, Reiner Fenske of Microtronic Inc., Woo Young Han of Onto Innovation and Jin Yu, PhD of Teradyne

Up next: 'Optimising opportunities for SiC success' ⚡ As sales of electric vehicles stutter, SiC revenues could face some bumps in the road ahead. So, what’s the best approach to optimising returns in these uncertain times? Speakers include: 🔹 Llew Vaughan-Edmunds - Navitas Semiconductor - '20 Years of SiC Innovation Leadership: Trench-Assisted Planar Gate Technology' 🔹 David Britz - Applied Materials - 'Solving Challenges in Compound Semiconductors: An Equipment Supplier’s Perspective' 🔹 Peter Friedrichs - Infineon Technologies - 'Building the World’s Most Cost-efficient SiC Fab' 🔹 Bernhard Hammerl - Siconnex - 'Integrated Metal Etch and Photoresist Strip Solution for SiC Manufacturing' 🔹 Mike Rosa - Onto Innovation - 'High Sensitivity & Throughput Defect Inspection Technologies for SiC and GaN Power Technologies' 🔹 Alessandro Rossi - SCREEN Semiconductor Solutions Co., Ltd. - 'SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Wafer Inspection and Thickness Measurement Tools and HVM experience' Make sure to attend these presentations for exclusive insights from industry experts! Take a look at the CS International Conference agenda here 👉 https://lnkd.in/eHMMZXU #CSInternationalConference #CSInternational #compoundsemiconductor #AngelTech

Why Thin Film Measurements Matter Controlling thin films to precise specifications is essential for ensuring high yield in high-performance devices. By Laura Peters. https://lnkd.in/g7sWygkC #semiconductor #thinfilms #metrology #processcontrol #TSVs #2nm #3nm #inspection Jiangtao Hu Onto Innovation Juliette Vandermeer Bruker Nano Surfaces & Metrology KLA Bruker Tignis Boyd F.

APC|M Europe runs April 8-10 in Prague, and the Onto Innovation team will there to discuss our unique lineup of process control solutions enabling our customers to meet today’s challenges without sacrificing throughput. To learn more about Onto, please visit: [link]. For more on APC|M Europe, please visit: [visit].

We're #hiring a new Senior SOX Auditor in Budd Lake, New Jersey. Apply today or share this post with your network.

📣Proud to announce that LPKF Laser & Electronics SE joined Onto Innovation's Packaging Applications Center of Excellence (PACE). PACE aims to develop seamless process integration and a secure supply chain to accelerate mass production of panel-level packages based on glass cores. These have become essential in the semiconductor architecture to meet the needs of demanding end applications like high-performance computing (#HPC), artificial intelligence (#AI), cloud computing and machine/deep learning 🦾 How we change glass based panel-level packaging together🚀 LPKF’s LIDE technology excels in micro-processing defect-free through glass vias (TGV) for advanced glass substrates. Onto Innovation’s Firefly system provides an automated inspection and metrology solution for advanced IC substrates and panel level packaging. Read more: https://lnkd.in/eQVMPaBS #semiconductor #AdvancedPackaging #GlassPackaging #innovation

Remote integration, tight deadlines, and a global pandemic—challenge accepted! 🤝 In 2020, Onto Innovation set out to integrate a new GEM300 metrology tool into an automated production line. With tight deadlines, COVID-related constraints, and the complexity of GEM300, they took on the challenge with determination. To support them, Agileo Automation brought its expertise in digital twins and GEM300 connectivity, making remote integration possible. By working closely across time zones, we ran simulations, supervised real-time operations with video support, and ensured a smooth acceptance process. Thanks to Onto Innovation’s trust and agility, and our team’s commitment, we delivered the project on time, with full functionality—proving that great collaboration knows no boundaries 🙏 Proud to have partnered with Onto Innovation on this achievement! #GEM300 #DigitalTwin #Semiconductor #Automation #IndustrialAutomation #SECSGEM Olivier Vittu Alexis GRANGER Maxence DRAUD

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era. By Anne Meixner. https://lnkd.in/gDGnAbNh #semiconductor #KGD #KnownGoodDie #inspection Nitza Basoco Teradyne Dave Armstrong Mark Gardner Intel Foundry Intel Corporation Rick Reed Amkor Technology, Inc. Nathan Peng Onto Innovation Advantest ASE Global IBM Gary Maier Leo Angelo Oabel GLENN PLACIDO Norbert Ackerl

We're #hiring a new Staff Systems Engineer in Milpitas, California. Apply today or share this post with your network.