The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
MEMS = Micro Electro Mechanical System
Any engineering system that performs electrical (switching ,deciding) and mechanical functions (sensing,moving,heating) with components in micrometers is a MEMS.
This document discusses microelectromechanical systems (MEMS) and electrostatic micro-actuators. It explains that MEMS integrate sensors, actuators and electronics on a silicon substrate using microfabrication technology. Electrostatic micro-actuators consist of thin fingers that are actuated by applying a voltage, generating an attractive electrostatic force due to fringing fields. The document derives equations for the electrostatic energy and force in a parallel plate capacitor model, showing that the force is independent of gap size. It describes the pull-in effect, where the gap decreases until reaching 2/3 of the original spacing, at which point the plates suddenly contact.
The document describes the LIGA process for fabricating microdevices. It involves three main steps: (1) X-ray lithography to pattern thick photoresist layers, (2) electroplating of metal into the pattern, and (3) removal of the photoresist template to produce free-standing metal microstructures. Key aspects of the LIGA process include using synchrotron radiation for X-ray exposure due to its high intensity and tunability, as well as the ability to create high-aspect-ratio microstructures through thick-resist exposure and development.
Micro machining involves removing material at the micro/nano scale to create small features and high precision surfaces. Key techniques include photolithography, which uses light passing through masks to pattern photoresist, and various etching methods like wet, dry, and plasma etching to remove material. Other important microfabrication processes are bulk micromachining, which etches the silicon substrate, surface micromachining which builds structures in layers, and LIGA which uses X-rays to create high aspect ratio metal parts through electroplating. These micro machining techniques enable manufacturing of complex micro-scale parts for applications like MEMS devices and biomedical tools.
Piezoresistive pressure sensors are one of the very-first products of MEMS technology. Those products are widely used in biomedical applications, automotive industry and household appliances.
The sensing material in a piezoresistive pressure sensor is a diaphragm formed on a silicon substrate, which bends with applied pressure. A deformation occurs in the crystal lattice of the diaphragm because of that bending. This deformation causes a change in the band structure of the piezoresistors that are placed on the diaphragm, leading to a change in the resistivity of the material. This change can be an increase or a decrease according to the orientation of the resistors.
This document discusses microelectromechanical systems (MEMS) fabrication methods. It covers common MEMS fabrication processes like deposition, lithography, and etching. Deposition methods include chemical vapor deposition and physical vapor deposition to deposit thin films. Lithography involves transferring patterns to photosensitive materials using masks and radiation exposure. Etching is used to selectively remove materials, including wet etching using chemicals and dry etching using reactive ions. The document also discusses challenges with MEMS packaging, limited prototyping and manufacturing options, and the need for improved design tools.
This document discusses scaling laws and how physical phenomena are affected as the size of systems decrease. Some key effects of decreasing size include friction and surface forces becoming more dominant over inertia and mass. Heat dissipation also increases relative to heat storage. Scaling laws can be used to determine how physical quantities vary with size, allowing evaluation of whether phenomena will scale favorably or poorly. The document provides several examples of how forces, resistance, capacitance and other factors are impacted by scaling and outlines approaches for systematically analyzing scaling effects using dimensional analysis and matrix formalization.
MEMS gyroscopes use microelectromechanical systems technology to sense rotation and turning motions. They contain tiny integrated mechanical and electrical components on a semiconductor chip that are designed to interact with their environment. MEMS gyroscopes detect rotation by taking advantage of the Coriolis effect on vibrating mechanical structures as the chip spins or rotates. They have a variety of applications including positioning spacecraft, detecting steering errors in vehicles, stabilizing images in cameras, and enabling motion sensing in gaming consoles and smartphones.
Mems accelerometer designing and fabricationprashant singh
This document provides an overview of MEMS capacitive accelerometers, including their design, fabrication, and applications. It first introduces MEMS and how accelerometers operate based on inertial sensing of acceleration. It then describes the basic operation principle and key components of a capacitive accelerometer, how capacitance changes are used to detect acceleration. The fabrication process is outlined, involving silicon etching and deposition steps to create the capacitive comb structure. Finally, common applications are listed, such as crash detection in automobiles, image stabilization in cameras, and navigation in aerospace.
The document discusses various crystal growth techniques including Czochralski (CZ), float zone, and Bridgman techniques. It describes the limitations of the CZ method including impurities introduced from the quartz crucible. The float zone technique produces very pure silicon crystals but allows for smaller wafer sizes. The Bridgman technique employs a temperature gradient to slowly cool a melt contained in a crucible to produce a single crystal ingot.
MEMS (micro-electro-mechanical systems) are microscopic devices and integrated systems that combine electrical and mechanical components between 1-100 micrometers in size. They integrate sensors, actuators and electronics on a common silicon substrate through microfabrication technology. MEMS originated in the 1980s and are now used in automotive, biomedical, industrial and consumer applications. Some key advantages of MEMS include lower manufacturing costs, reduced size, and lower power consumption compared to macro-scale devices. Challenges include developing robust packaging and manufacturing processes for commercialization.
This document provides an overview of microelectromechanical systems (MEMS) technology. It discusses how MEMS devices are fabricated using modified silicon and non-silicon techniques to create tiny integrated systems combining mechanical and electrical components on the microscale. The document outlines common MEMS fabrication methods like surface micromachining, bulk micromachining, and LIGA. It also discusses MEMS design processes, packaging challenges, and applications. The future of MEMS is presented as enabling more advanced automotive, medical, and environmental applications through continued innovation in areas like foundry access and design tools.
This document discusses microactuators that use thermal forces, shape memory alloys, or piezoelectric materials to generate actuation. It also lists various applications for microactuators including medical devices, lab-on-a-chip technologies, microfluidics, and more.
MEMS (Micro-Electro-Mechanical Systems) involves integrating mechanical elements, sensors and actuators with electronics on a silicon chip using microfabrication. Silicon micromachining is used to create microscopic mechanical parts and structures through processes like bulk and surface micromachining. Bulk micromachining selectively removes silicon material to create mechanical structures using etching techniques like wet and dry etching.
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
This document provides an overview of optical MEMS (Microelectromechanical Systems). It discusses how MEMS integrate microsensors, microactuators and microelectronics onto a silicon chip. It then focuses on optical MEMS, explaining how they fuse optics, MEMS and microelectronics. Key topics covered include fabrication techniques like bulk micromachining and surface micromachining, as well as applications like digital micromirror devices and fast optical switching using semiconductor optical cavities. The document highlights advantages of optical MEMS like high speed, density and cost effectiveness over electronic switches.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to develop microsensors using materials like metals, polymers, ceramics, semiconductors, and composites. Common applications of MEMS include accelerometers, which have advantages over conventional accelerometers such as lower cost, smaller size, and lower power requirements.
This document discusses MEMS packaging at different levels. It describes microelectronic packaging as providing mechanical support, electrical connections and protection from environmental threats for integrated circuits. There are 5 levels of microelectronic packaging from the silicon chip to larger systems. MEMS and microsystem packaging aims to protect delicate core elements from mechanical or environmental damage during operation. Proper packaging design considers costs, environmental effects, reliability and achieving minimum electrical connections to prevent failures.
This document provides an overview of Microelectromechanical Systems (MEMS). It describes MEMS as systems that combine electrical and mechanical components on a chip to produce miniature devices that can sense, control and actuate on a micro scale. The key components of MEMS are microelectronics, microsensors, microstructures and microactuators. Common fabrication processes for MEMS include deposition, patterning, etching, and lithography. MEMS have a wide range of applications in areas like automotive, medical, and defense.
Extreme ultraviolet lithography (EUVL) is an advanced lithography technique needed to continue following Moore's Law and make more powerful microprocessors. EUVL uses light with a wavelength of 13.5nm, which is much shorter than visible light, allowing for smaller feature sizes. The EUVL process involves projecting a mask pattern through a series of reflective mirrors onto a photoresist-coated wafer under vacuum. Key aspects of EUVL include the use of reflective masks and all-reflective optical systems since materials absorb 13.5nm light. EUVL promises increased processor speeds and storage capacity but faces challenges like low mirror reflectivity and contamination control required for the vacuum environment.
Introduction to Micro Sensors and Transducers. Application of MEMS in industries and their basic architecture. MEMS accelerometer and gyroscope explored a bit i.e. their structures and their applications.
1. Spintronics uses electron spins in addition to or instead of electron charge to manipulate, store, and transfer information. This could help overcome limitations of Moore's Law as transistors reach nanoscale dimensions.
2. In spintronic devices, information is represented by the orientation of electron spin (up or down), analogous to 1s and 0s in binary. Certain materials can retain spin orientation when power is off, enabling non-volatile memory.
3. Spintronic devices like GMR spin valves and magnetic tunnel junctions in MRAM can switch between low and high resistance states by altering the relative alignment of magnetic layers, allowing them to represent bits. MRAM promises high density, speed and non
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
This document discusses the course ME407 Mechatronics. The course objectives are to introduce various sensors used in machines and robots, study MEMS pressure and inertial sensors, and develop hydraulic/pneumatic circuits and PLC programs. The expected outcomes are for students to understand mechanical systems in mechatronics and integrate mechanical, electronic, control and computer engineering in design. The syllabus covers introduction to mechatronics, sensors, actuators, MEMS, and case studies. Fabrication of MEMS is also discussed, including deposition, patterning using photolithography, and etching processes.
Fibre optic pressure and temperature sensorI'am Ajas
This document describes a fibre optic sensor for measuring pressure and temperature in geothermal wells. The sensor uses an extrinsic Fabry-Perot interferometer to measure pressure and a fibre Bragg grating to measure temperature. It was tested under simulated wellbore conditions and demonstrated the ability to accurately measure both pressure and temperature. The sensor provides a simple, miniature, and robust solution for downhole monitoring in geothermal applications.
This document provides an introduction to microelectromechanical systems (MEMS). It defines MEMS as systems that combine electrical and mechanical components on the micrometer scale to sense and control the physical world. MEMS components include microsensors to detect environmental changes, an intelligent component to make decisions based on sensor input, and microactuators to change the environment based on the decisions. Common MEMS applications include accelerometers, inkjet printer heads, medical devices, and sensors in automobiles. The document discusses fabrication techniques like deposition, patterning, and etching used to create MEMS, as well as their advantages like low cost, small size, and high functionality.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
MEMS gyroscopes use microelectromechanical systems technology to sense rotation and turning motions. They contain tiny integrated mechanical and electrical components on a semiconductor chip that are designed to interact with their environment. MEMS gyroscopes detect rotation by taking advantage of the Coriolis effect on vibrating mechanical structures as the chip spins or rotates. They have a variety of applications including positioning spacecraft, detecting steering errors in vehicles, stabilizing images in cameras, and enabling motion sensing in gaming consoles and smartphones.
Mems accelerometer designing and fabricationprashant singh
This document provides an overview of MEMS capacitive accelerometers, including their design, fabrication, and applications. It first introduces MEMS and how accelerometers operate based on inertial sensing of acceleration. It then describes the basic operation principle and key components of a capacitive accelerometer, how capacitance changes are used to detect acceleration. The fabrication process is outlined, involving silicon etching and deposition steps to create the capacitive comb structure. Finally, common applications are listed, such as crash detection in automobiles, image stabilization in cameras, and navigation in aerospace.
The document discusses various crystal growth techniques including Czochralski (CZ), float zone, and Bridgman techniques. It describes the limitations of the CZ method including impurities introduced from the quartz crucible. The float zone technique produces very pure silicon crystals but allows for smaller wafer sizes. The Bridgman technique employs a temperature gradient to slowly cool a melt contained in a crucible to produce a single crystal ingot.
MEMS (micro-electro-mechanical systems) are microscopic devices and integrated systems that combine electrical and mechanical components between 1-100 micrometers in size. They integrate sensors, actuators and electronics on a common silicon substrate through microfabrication technology. MEMS originated in the 1980s and are now used in automotive, biomedical, industrial and consumer applications. Some key advantages of MEMS include lower manufacturing costs, reduced size, and lower power consumption compared to macro-scale devices. Challenges include developing robust packaging and manufacturing processes for commercialization.
This document provides an overview of microelectromechanical systems (MEMS) technology. It discusses how MEMS devices are fabricated using modified silicon and non-silicon techniques to create tiny integrated systems combining mechanical and electrical components on the microscale. The document outlines common MEMS fabrication methods like surface micromachining, bulk micromachining, and LIGA. It also discusses MEMS design processes, packaging challenges, and applications. The future of MEMS is presented as enabling more advanced automotive, medical, and environmental applications through continued innovation in areas like foundry access and design tools.
This document discusses microactuators that use thermal forces, shape memory alloys, or piezoelectric materials to generate actuation. It also lists various applications for microactuators including medical devices, lab-on-a-chip technologies, microfluidics, and more.
MEMS (Micro-Electro-Mechanical Systems) involves integrating mechanical elements, sensors and actuators with electronics on a silicon chip using microfabrication. Silicon micromachining is used to create microscopic mechanical parts and structures through processes like bulk and surface micromachining. Bulk micromachining selectively removes silicon material to create mechanical structures using etching techniques like wet and dry etching.
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
This document provides an overview of optical MEMS (Microelectromechanical Systems). It discusses how MEMS integrate microsensors, microactuators and microelectronics onto a silicon chip. It then focuses on optical MEMS, explaining how they fuse optics, MEMS and microelectronics. Key topics covered include fabrication techniques like bulk micromachining and surface micromachining, as well as applications like digital micromirror devices and fast optical switching using semiconductor optical cavities. The document highlights advantages of optical MEMS like high speed, density and cost effectiveness over electronic switches.
MEMS (micro-electro-mechanical systems) combine mechanical and electrical functions on a single chip using microfabrication technology. The fabrication process for MEMS is similar to that used for making electronic circuits and involves steps such as chemical deposition, physical deposition, lithography, and etching. MEMS can be used to develop microsensors using materials like metals, polymers, ceramics, semiconductors, and composites. Common applications of MEMS include accelerometers, which have advantages over conventional accelerometers such as lower cost, smaller size, and lower power requirements.
This document discusses MEMS packaging at different levels. It describes microelectronic packaging as providing mechanical support, electrical connections and protection from environmental threats for integrated circuits. There are 5 levels of microelectronic packaging from the silicon chip to larger systems. MEMS and microsystem packaging aims to protect delicate core elements from mechanical or environmental damage during operation. Proper packaging design considers costs, environmental effects, reliability and achieving minimum electrical connections to prevent failures.
This document provides an overview of Microelectromechanical Systems (MEMS). It describes MEMS as systems that combine electrical and mechanical components on a chip to produce miniature devices that can sense, control and actuate on a micro scale. The key components of MEMS are microelectronics, microsensors, microstructures and microactuators. Common fabrication processes for MEMS include deposition, patterning, etching, and lithography. MEMS have a wide range of applications in areas like automotive, medical, and defense.
Extreme ultraviolet lithography (EUVL) is an advanced lithography technique needed to continue following Moore's Law and make more powerful microprocessors. EUVL uses light with a wavelength of 13.5nm, which is much shorter than visible light, allowing for smaller feature sizes. The EUVL process involves projecting a mask pattern through a series of reflective mirrors onto a photoresist-coated wafer under vacuum. Key aspects of EUVL include the use of reflective masks and all-reflective optical systems since materials absorb 13.5nm light. EUVL promises increased processor speeds and storage capacity but faces challenges like low mirror reflectivity and contamination control required for the vacuum environment.
Introduction to Micro Sensors and Transducers. Application of MEMS in industries and their basic architecture. MEMS accelerometer and gyroscope explored a bit i.e. their structures and their applications.
1. Spintronics uses electron spins in addition to or instead of electron charge to manipulate, store, and transfer information. This could help overcome limitations of Moore's Law as transistors reach nanoscale dimensions.
2. In spintronic devices, information is represented by the orientation of electron spin (up or down), analogous to 1s and 0s in binary. Certain materials can retain spin orientation when power is off, enabling non-volatile memory.
3. Spintronic devices like GMR spin valves and magnetic tunnel junctions in MRAM can switch between low and high resistance states by altering the relative alignment of magnetic layers, allowing them to represent bits. MRAM promises high density, speed and non
Microelectromechanical Systems (MEMS) are miniature devices comprising of integrated mechanical (levers, springs, deformable membranes, vibrating structures, etc.) and electrical (resistors, capacitors, inductors, etc.) components designed to work in concert to sense and report on the physical properties of their immediate or local environment, or, when signaled to do so, to perform some kind of controlled physical interaction or actuation with their immediate or local environment
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
This document discusses the course ME407 Mechatronics. The course objectives are to introduce various sensors used in machines and robots, study MEMS pressure and inertial sensors, and develop hydraulic/pneumatic circuits and PLC programs. The expected outcomes are for students to understand mechanical systems in mechatronics and integrate mechanical, electronic, control and computer engineering in design. The syllabus covers introduction to mechatronics, sensors, actuators, MEMS, and case studies. Fabrication of MEMS is also discussed, including deposition, patterning using photolithography, and etching processes.
Fibre optic pressure and temperature sensorI'am Ajas
This document describes a fibre optic sensor for measuring pressure and temperature in geothermal wells. The sensor uses an extrinsic Fabry-Perot interferometer to measure pressure and a fibre Bragg grating to measure temperature. It was tested under simulated wellbore conditions and demonstrated the ability to accurately measure both pressure and temperature. The sensor provides a simple, miniature, and robust solution for downhole monitoring in geothermal applications.
This document provides an introduction to microelectromechanical systems (MEMS). It defines MEMS as systems that combine electrical and mechanical components on the micrometer scale to sense and control the physical world. MEMS components include microsensors to detect environmental changes, an intelligent component to make decisions based on sensor input, and microactuators to change the environment based on the decisions. Common MEMS applications include accelerometers, inkjet printer heads, medical devices, and sensors in automobiles. The document discusses fabrication techniques like deposition, patterning, and etching used to create MEMS, as well as their advantages like low cost, small size, and high functionality.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
This document discusses advances in synthesizing ZnO nanomaterials for varistor devices. It describes how ZnO varistors work by becoming highly conductive during voltage surges to protect electrical circuits. Controlling the microstructure through nanostructuring and chemical routes can produce varistors with high breakdown voltages, important for applications like mobile phones. Recent advances in chemical processing methods like sol-gel and precipitation to synthesize varistors from ZnO nanomaterials are outlined. Uncontrolled grain growth at high temperatures remains a challenge for obtaining good electrical properties in nano-varistors. Novel sintering techniques may help control grain growth for optimizing electrical characteristics.
The document discusses photolithography, which is a key process in microfabrication. It describes the basic photolithography process which involves coating a wafer with photoresist, exposing it to UV light through a mask, developing it to remove either exposed or unexposed areas of resist, and then using the patterned resist for etching or deposition. The document provides details on the components used, including masks, photoresist materials, and exposure systems. It also explains the various steps such as surface cleaning, soft/hard baking, development, and inspection.
IRJET- Experimental Investigation on Nickel Aluminium Alloy by Electric D...IRJET Journal
This document presents an experimental investigation on machining nickel aluminium alloy composites containing 4%, 6%, and 8% alumina by weight using electric discharge machining (EDM). The composites were characterized for hardness and tensile strength. EDM was used to machine the composites and statistical models were developed to predict material removal rate and surface roughness based on discharge current, pulse-on time, and duty cycle. It was found that material removal rate increased with discharge current and duty cycle but initially decreased and then increased with pulse-on time. Surface roughness increased with discharge current and pulse-on time. The study provides scope for future work investigating other composites and dielectric fluids using EDM.
PolyMEMS INAOE, a Surface Micromachining Fabrication Module and the Developm...José Andrés Alanís Navarro
The PolyMEMS INAOE module for surface micromachining has been developed for the fabrication of electrostatic and electrothermal (Joule effect) sensors and actuators. In this module the designer can choose up to 3 Poly silicon layers and aluminum as electrical interconnecting material. A
micromechanical test chip has been fabricated which includes the following. a) Micro test structures for residual stress measurement; cantilever beams, clamped-clamped beams, ring-and-beam structures, diamond-and-beam structures, rotation beams, Vernier gauges, cantilever spirals, double-clamped microgauge, and b) Actuators; torsion and bending mirrors, resonators, single two-arms Joule structures (STA), chevron-like Joule arrays, capacitive array for accelerometers. In this work we are presenting the measured residual stress on our process, by using the clamped-clamped beam and ring-and-beam arrays. The measured compressive stress is in the 21-26 MPa range for both types of microgauges. A maximum typical value for this tensile stress is 50 MPa, which is higher than that obtained in our experimental procedure. From this residual stress measurement technique and other mechanical testing routines we can conclude the following: the thermal load, the polysilicon microstructure, and the releasing technique; all of them result in a reliable process for the fabrication of dynamic and static polysilicon microstructures.
Micro-electromechanical systems (MEMS) combine mechanical and electrical components on a silicon chip using microfabrication techniques. MEMS can sense, control, and actuate on a microscale and generate macroscale effects. Common MEMS fabrication techniques include deposition, patterning, etching, and micromachining of materials like silicon and metals. There are three main micromachining methods: bulk micromachining which removes silicon substrate material, surface micromachining which builds up thin films, and high-aspect-ratio micromachining (HARM) which allows molding of high-resolution microstructures. LIGA is a specialized HARM technique that uses x-rays to pattern thick photoresist
IRJET- Investigation on Electrochemical Machining of Inconel 718 AlloyIRJET Journal
This document summarizes an investigation into electrochemical machining (ECM) of Inconel 718 alloy. It provides background on ECM and Inconel 718, including chemical composition and properties. The study examined the effect of input parameters like voltage, electrolyte concentration, and feed rate on the material removal rate when ECM Inconel 718. Results showed that material removal rate initially increases and then further increases with higher voltage and electrolyte concentration. Current was found to be the most influential parameter on removing material from the workpiece. In conclusion, controlling input parameters like voltage, electrolyte concentration, and current can improve the efficiency of ECM for machining difficult alloys like Inconel 718.
Fabrication and studying the dielectric properties of (polystyrene-copper oxi...journalBEEI
This document summarizes a study that fabricated (polystyrene-copper oxide) nanocomposites for potential piezoelectric applications. Copper oxide nanoparticles were added to polystyrene at concentrations of 0, 4, 8 and 12 wt.%. The dielectric constant, dielectric loss, and AC electrical conductivity increased with higher copper oxide concentrations and increased frequency. The electrical resistance of the nanocomposites decreased with increasing pressure, showing piezoelectric behavior. The nanocomposites showed potential for use in piezoelectric sensors due to their sensitivity to pressure changes.
Design And Development of Low-Cost Electrospinning Machine for NanoFabricatio...MuhammadHaseebAshiq
This document is a final year project proposal submitted by four students for their BS in Electrical Engineering. They propose to design and develop a low-cost electrospinning machine for nanofabrication. Their objectives are to build a prototype machine with mechanical and electrical components including a stepper motor syringe pump and DC motor collector drum. They will calibrate the machine to optimize spinning parameters. An extensive literature review covers the history of electrospinning development from 1902 to the present and describes the basic electrospinning process of using high voltage to eject charged polymer fibers from a needle tip onto a grounded collector.
A seminar report on Nuclear Micro BatteryUtkarsh Kumar
This document is a seminar report submitted by Utkarsh Kumar to fulfill the requirements for a Bachelor of Technology degree. The report discusses nuclear micro-batteries, which could potentially power microelectromechanical systems by harnessing energy from radioactive decay. It describes several proposed designs for nuclear micro-batteries, including a junction-type battery that uses charged particles to induce a voltage, and a self-reciprocating cantilever design that uses particle collection to power oscillating motion. The report also addresses isotope selection, safety considerations, advantages, disadvantages and applications of nuclear micro-batteries.
The document summarizes research on the micro-EDM process parameters for machining nickel-titanium shape memory alloys. It discusses how the micro-EDM process works based on electrical discharges that vaporize material in a small gap between the electrode and workpiece. The research investigated the effects of capacitance, discharge voltage, and electrode material on the material removal rate and tool wear rate during micro-EDM of nickel-titanium alloys. It found that material removal rate increased with higher capacitance and discharge voltage, and was better with a brass electrode than tungsten. Tool wear rate also increased with higher capacitance and voltage but was lower at lower energy levels and with a tungsten electrode.
Navigating The Nanoworld The Intricacies Of Probe Card ManufacturingSemi Probes Inc
Probe cards are essential tools used to test integrated circuits on semiconductor wafers. They have an array of tiny probes that make contact with the wafer pads to enable electrical testing. The manufacturing process involves meticulous design, precision machining, assembly in a sterile environment, and rigorous testing. Advanced techniques like microfabrication and MEMS probes help improve testing accuracy and efficiency as components shrink, while new materials enhance reliability. Probe cards play a crucial role in semiconductor quality control, yield enhancement, and efficient production timelines and costs. Their advancement parallels the constant push for smaller, more powerful semiconductor technologies.
Modeling of EDM Process parameters for MRR of Inconel 600 alloy using RSMsushil Choudhary
In this study, a RSM is applied to predict MRR in die sinking EDM for Inconel 600 superalloy with Tungsten carbide (WC) electrode. To investigate the MRR, the main operating parameters peak current (Ip), gap voltage (Vg), pulse-on time (Ton), and duty factor (DF) are taken into consideration. The tests were designed employing a central composite design (CCD) using the usage of statistical software Design-Expert-9.0. RSM created mathematical models for MRR performance characteristic of the EDM process. The studies were carried out with the use of a face-centered-central-composite-design and 30 runs. For assessing and modelling the EDM process parameters for performance characteristic, a common second-order experimental design known as face-centered-central composite-design was used. A mathematical model was created to correlate the effects of these machining parameters and MRR after the of 30 experiments. At a 5% level of significance, ANOVA was performed to obtain the factors that affect the quality. Peak current, pulse on time, and duty factor were revealed from the data to have a substantial influence on the MRR. Confirmation experiments validated the expected optimal range of MRR at 95 percent confidence level, and the MRR was determined to be 20.656 mm3/min.
A review study of mechanical fatigue testing methods for small scale metal ma...Alexander Decker
This document reviews mechanical fatigue testing techniques for small-scale metal materials. It begins by discussing the increased focus on materials behavior at the micro and nano scales due to growing MEMS/NEMS applications. It then classifies fatigue testing techniques for small-scale materials, including uniaxial tension-tension, dynamic bending, and uniaxial tension-compression. Specific techniques are described in more detail, such as using piezoelectric actuators to enable load-controlled uniaxial cyclic loading of thin films. The document also examines fatigue properties of materials tested with these techniques, like studying crack growth rates in nickel alloy cantilever beams under dynamic bending.
A review study of mechanical fatigue testing methods for small scale metal ma...Alexander Decker
This document reviews mechanical fatigue testing techniques for small-scale metal materials. It begins by discussing the importance of characterizing the mechanical properties of materials used in micro-electromechanical systems. It then classifies and describes various fatigue testing techniques for small-scale materials, including uniaxial tension-tension testing, dynamic bending, and uniaxial tension-compression. Specific examples of how each technique has been used to test materials like copper thin films, carbon nanotube wires, and nickel alloy cantilever beams are provided. The document concludes by discussing factors to consider when developing testing methods for materials at the micro and nano scales.
Moletronics or molecular electronics - technical seminarSUKHWINDER SINGH
Molecular electronics is an emerging technology that uses individual molecules as electronic components like diodes and transistors to build circuits. It works by manipulating molecules so they function together electronically. Materials used include organic polymers, polyphenylene chains, carbon nanotubes. Advantages over conventional electronics include smaller size and lower costs, while challenges remain in controlled fabrication at the molecular scale. Potential applications include molecular sensors, switches, memory storage that could revolutionize computing.
This document summarizes a technical seminar presented on smart materials. It begins with an introduction defining smart materials as materials that can respond to environmental stimuli by changing their physical properties. The seminar then covers the need for smart materials, components of a smart system, classifications and applications of smart materials, and civil engineering applications. Control systems are discussed, distinguishing between open loop and closed loop control. In conclusion, the author notes the cost effectiveness and monitoring benefits of smart materials for new and existing construction projects.
This document provides an introduction and abstract for a seminar report on spintronics. It was submitted by B. Dhana Lakshmi to Jawaharlal Nehru Technological University in partial fulfillment of a Bachelor of Technology degree in Electronics and Communication Engineering. The abstract indicates that the seminar will cover topics such as spintronic devices including magnetic random access memory, advances in spintronics, and applications in areas such as magnetic biosensing. It provides key definitions for spintronics and lists chapters that will be included in the seminar report.
Deepfake Phishing: A New Frontier in Cyber ThreatsRaviKumar256934
n today’s hyper-connected digital world, cybercriminals continue to develop increasingly sophisticated methods of deception. Among these, deepfake phishing represents a chilling evolution—a combination of artificial intelligence and social engineering used to exploit trust and compromise security.
Deepfake technology, once a novelty used in entertainment, has quickly found its way into the toolkit of cybercriminals. It allows for the creation of hyper-realistic synthetic media, including images, audio, and videos. When paired with phishing strategies, deepfakes can become powerful weapons of fraud, impersonation, and manipulation.
This document explores the phenomenon of deepfake phishing, detailing how it works, why it’s dangerous, and how individuals and organizations can defend themselves against this emerging threat.
Construction Materials (Paints) in Civil EngineeringLavish Kashyap
This file will provide you information about various types of Paints in Civil Engineering field under Construction Materials.
It will be very useful for all Civil Engineering students who wants to search about various Construction Materials used in Civil Engineering field.
Paint is a vital construction material used for protecting surfaces and enhancing the aesthetic appeal of buildings and structures. It consists of several components, including pigments (for color), binders (to hold the pigment together), solvents or thinners (to adjust viscosity), and additives (to improve properties like durability and drying time).
Paint is one of the material used in Civil Engineering field. It is especially used in final stages of construction project.
Paint plays a dual role in construction: it protects building materials and contributes to the overall appearance and ambiance of a space.
In this paper, the cost and weight of the reinforcement concrete cantilever retaining wall are optimized using Gases Brownian Motion Optimization Algorithm (GBMOA) which is based on the gas molecules motion. To investigate the optimization capability of the GBMOA, two objective functions of cost and weight are considered and verification is made using two available solutions for retaining wall design. Furthermore, the effect of wall geometries of retaining walls on their cost and weight is investigated using four different T-shape walls. Besides, sensitivity analyses for effects of backfill slope, stem height, surcharge, and backfill unit weight are carried out and of soil. Moreover, Rankine and Coulomb methods for lateral earth pressure calculation are used and results are compared. The GBMOA predictions are compared with those available in the literature. It has been shown that the use of GBMOA results in reducing significantly the cost and weight of retaining walls. In addition, the Coulomb lateral earth pressure can reduce the cost and weight of retaining walls.
OPTIMIZING DATA INTEROPERABILITY IN AGILE ORGANIZATIONS: INTEGRATING NONAKA’S...ijdmsjournal
Agile methodologies have transformed organizational management by prioritizing team autonomy and
iterative learning cycles. However, these approaches often lack structured mechanisms for knowledge
retention and interoperability, leading to fragmented decision-making, information silos, and strategic
misalignment. This study proposes an alternative approach to knowledge management in Agile
environments by integrating Ikujiro Nonaka and Hirotaka Takeuchi’s theory of knowledge creation—
specifically the concept of Ba, a shared space where knowledge is created and validated—with Jürgen
Habermas’s Theory of Communicative Action, which emphasizes deliberation as the foundation for trust
and legitimacy in organizational decision-making. To operationalize this integration, we propose the
Deliberative Permeability Metric (DPM), a diagnostic tool that evaluates knowledge flow and the
deliberative foundation of organizational decisions, and the Communicative Rationality Cycle (CRC), a
structured feedback model that extends the DPM, ensuring long-term adaptability and data governance.
This model was applied at Livelo, a Brazilian loyalty program company, demonstrating that structured
deliberation improves operational efficiency and reduces knowledge fragmentation. The findings indicate
that institutionalizing deliberative processes strengthens knowledge interoperability, fostering a more
resilient and adaptive approach to data governance in complex organizations.
This research is oriented towards exploring mode-wise corridor level travel-time estimation using Machine learning techniques such as Artificial Neural Network (ANN) and Support Vector Machine (SVM). Authors have considered buses (equipped with in-vehicle GPS) as the probe vehicles and attempted to calculate the travel-time of other modes such as cars along a stretch of arterial roads. The proposed study considers various influential factors that affect travel time such as road geometry, traffic parameters, location information from the GPS receiver and other spatiotemporal parameters that affect the travel-time. The study used a segment modeling method for segregating the data based on identified bus stop locations. A k-fold cross-validation technique was used for determining the optimum model parameters to be used in the ANN and SVM models. The developed models were tested on a study corridor of 59.48 km stretch in Mumbai, India. The data for this study were collected for a period of five days (Monday-Friday) during the morning peak period (from 8.00 am to 11.00 am). Evaluation scores such as MAPE (mean absolute percentage error), MAD (mean absolute deviation) and RMSE (root mean square error) were used for testing the performance of the models. The MAPE values for ANN and SVM models are 11.65 and 10.78 respectively. The developed model is further statistically validated using the Kolmogorov-Smirnov test. The results obtained from these tests proved that the proposed model is statistically valid.
この資料は、Roy FieldingのREST論文(第5章)を振り返り、現代Webで誤解されがちなRESTの本質を解説しています。特に、ハイパーメディア制御やアプリケーション状態の管理に関する重要なポイントをわかりやすく紹介しています。
This presentation revisits Chapter 5 of Roy Fielding's PhD dissertation on REST, clarifying concepts that are often misunderstood in modern web design—such as hypermedia controls within representations and the role of hypermedia in managing application state.
[PyCon US 2025] Scaling the Mountain_ A Framework for Tackling Large-Scale Te...Jimmy Lai
Managing tech debt in large legacy codebases isn’t just a challenge—it’s an ongoing battle that can drain developer productivity and morale. In this talk, I’ll introduce a Python-powered Tech Debt Framework bar-raiser designed to help teams tackle even the most daunting tech debt problems with 100,000+ violations. This open-source framework empowers developers and engineering leaders by: - Tracking Progress: Measure and visualize the state of tech debt and trends over time. - Recognizing Contributions: Celebrate developer efforts and foster accountability with contribution leaderboards and automated shoutouts. - Automating Fixes: Save countless hours with codemods that address repetitive debt patterns, allowing developers to focus on higher-priority work.
Through real-world case studies, I’ll showcase how we: - Reduced 70,000+ pyright-ignore annotations to boost type-checking coverage from 60% to 99.5%. - Converted a monolithic sync codebase to async, addressing blocking IO issues and adopting asyncio effectively.
Attendees will gain actionable strategies for scaling Python automation, fostering team buy-in, and systematically reducing tech debt across massive codebases. Whether you’re dealing with type errors, legacy dependencies, or async transitions, this talk provides a roadmap for creating cleaner, more maintainable code at scale.
Jacob Murphy Australia - Excels In Optimizing Software ApplicationsJacob Murphy Australia
In the world of technology, Jacob Murphy Australia stands out as a Junior Software Engineer with a passion for innovation. Holding a Bachelor of Science in Computer Science from Columbia University, Jacob's forte lies in software engineering and object-oriented programming. As a Freelance Software Engineer, he excels in optimizing software applications to deliver exceptional user experiences and operational efficiency. Jacob thrives in collaborative environments, actively engaging in design and code reviews to ensure top-notch solutions. With a diverse skill set encompassing Java, C++, Python, and Agile methodologies, Jacob is poised to be a valuable asset to any software development team.
Substrate / wafers and Basic concepts Of Mems & microsystems
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MEMS &
MicrosystemsMICRO-ELECTRO-MECHANICAL SYSTEMS
”Machine on a chip” / “Micro-machine”
Or
”Anything designed and produced using Microelectronics toolset ”
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MEMS &
Microsystems
MICRO-ELECTRO-MECHANICAL SYSTEMS
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Contents:
• Substrate or Wafers
• Substrate Materials
• Silicon as a Substrate Material
• Miller Indices
• Mechanical properties of Silicon
• Silicon Compounds
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Wafers
• A wafer, also called a slice, is a thin slice of
semiconductor material, such as a crystalline silicon,
used in electronics for the fabrication of integrated
circuits and in photovoltaics for conventional,
wafer-based solar cells.
• The wafer serves as the layer for microelectronic
devices built in and over the wafer and undergoes
many microfabrication process steps such as doping
of ion implantation, etching, deposition of various
materials, and photolithographic patterning.
• Finally the individual microcircuits are separated
(dicing) and packaged.
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Wafers
• Wafer is a solid substance onto which a layer of another
substance is applied, and to which that second
substance adheres.
• In solid-state electronics, this term refers to a thin slice
of material such as silicon, silicon dioxide, aluminum
oxide, sapphire, germanium, gallium arsenide (GaAs), an
alloy of silicon and germanium, or indium phosphide
(InP).
• These serve as the foundation upon which electronic
devices such as transistors, diodes, and especially
integrated circuits (ICs) are deposited.
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Wafer
• Wafers are formed of highly pure (99.9999999%
purity), nearly defect-free single crystalline
material.
• The wafer is a slice cut from a larger piece of a
single crystal substrate. Wafers can be of silicon
or other single crystalline material such as quartz
or gallium arsenide.
• A single crystal is a material in which
the crystal lattice of the entire sample
is continuous and unbroken.
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Wafer & Substrate
• In microelectronics, the wafer means a
flat macroscopic object on which
micro-fabrication processes take place.
• In microsystems, a substrate serves an
additional purpose: it acts as signal
transducer besides supporting other
transducers that convert mechanical
actions to electrical outputs or vice
versa.
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Substrates / Wafers Materials
The common substrate materials used in MEMS are silicon (Si), germanium
(Ge), and gallium arsenide (GaAs) all fall in the category of semiconductors.
One major reason for using these materials as principal substrate materials
in both microelectronics and microsystems is that these materials are at the
borderline between conductors and insulators, so they can be made either a
conductor or an insulator as needs arise.
The doping techniques can be used to convert the most commonly used
semiconducting material to an electrically conducting material by doping it
with a foreign material for conducting electricity.
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Substrate Material
substrate materials
for microsystems
with typical
electrical resistivity
of conductors,
semiconductors and
insulators are
shown below:
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Substrate / wafer Material
There are two types of substrate
materials used in microsystems:
1- Passive substrate materials
2- Active substrate materials
The passive material is one that does not play an essential role in the
sensing mechanism.
Passive materials are only used to provide either mechanical structure
or electrical connection.
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Active Substrate Materials
• Active substrate materials are
primarily used for sensors and
actuators in a microsystems and in
other MEMS components.
• Typical active substrate materials
for microsystems include silicon,
gallium arsenide, germanium, and
quartz.
Silicon
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Active Substrate Materials
• These substrate materials have
basically a cubic crystal lattice
with a tetrahedral atomic bond.
• These materials are selected as
active substrates primarily for
their dimensional stability, which
is relatively insensitive to
environmental conditions.
Silicon
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Active Substrate Materials
• Dimensional stability is a critical
requirement for sensors and
actuators with high precision
Silicon
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Silicon as a Substrate Material
Silicon is the most widely used substrate material for MEMS and microsystems.
The popularity of silicon for such application is primarily for the following
reasons:
1. It is mechanically stable and it can be integrated into electronics on the same
substrate.
2. Electronics for signal transduction, such as a p- or n-type piezoresistor, can be
readily integrated with the Si substrate.
3. Silicon is almost an ideal structural material. It has about the same Young’s
modulus as steel (about 2 x 105 MPa), but is as light as aluminum, with a mass
density of about 2.3 g/cm3
.
Materials with a high Young’s modulus can better maintain a linear relationship
between applied load and the induced deformations.
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Silicon as a Substrate Material
4. It has a melting point at 1400°C, which is about twice as high as that of
aluminum. This high melting point makes silicon dimensionally stable even at
elevated temperature.
5. Its thermal expansion coefficient is about 8 times smaller than that of steel,
and is more than 10 times smaller than that of aluminum.
It is thus an ideal candidate material for sensors and actuators.
The silicon wafers are extremely flat and accept coatings and additional thin-
film layers for building micro-structural geometry or conducting electricity.
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Miller Indices
Miller indices form a notation system in crystallography for planes in crystal lattices.
The family of lattice planes is determined by three integers h, k, and ℓ, the Miller
indices.
Crystallography is the experimental science of determining the arrangement of
atoms in the crystalline solids.
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Miller Indices
It is often necessary to be able to specify certain directions
and planes in crystals.
Many material properties and machining processes vary
with direction in the crystal.
The strength of material also vary with direction in the
crystal.
The wafers that are shipped by suppliers normally indicate
in which directions, the cuts have been made to make flat
surface.
Directions and planes are described using three integers
Miller Indices. Miller index is denoted by (hkl).
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Miller Indices
STEP-2 Specify the intercepts in fractional co-ordinates
Fractional Intercepts : a/a , ∞/a, ∞/a i.e. 1 , ∞ , ∞
STEP-1 Identify the intercepts on the x- , y- and z- axes.
It intercepts on the x- axes at point a.
The surface is parallel to the y- and z-axes.
Therefore, intercepts on both axes is ∞.
The point is (x,y,z)=(a, ∞, ∞)
STEP-3 Take the reciprocals of the fractional intercepts
Reciprocals : 1/1 , ∞/1, ∞/1 i.e. 1 , 0 , 0
Therefore: Miller Indices : (100)
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Miller Index
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Miller Indices
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Miller Indices
On <111> plane, the lattice distances between adjacent atoms are shortest.
These short lattice distances between atoms make the attractive forces between atoms
stronger on this plane than those on the other two planes.
Also, this plane contains three of the four atoms that are situated at the center of the faces
of the unit cell.
Thus, the growth of crystal in this plane is the slowest and the fabrication processes, e.g.,
etching, as we will learn will proceed slowest.
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Miller Indices
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TASK # 1
Search publication on following topic.
MICRO MANUFACTURING
Read Abstract and Conclusion
Write a summary of minimum two pages and reply
the following queries.
WHAT, WHY, WHERE, WHO, WHOM, and HOW
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Mechanical Properties of Silicon
• It is a prime material in MEMS microsystems for sensors and actuators.
• Its three dimensional geometry withstand often severe mechanical and
thermal loads, and accommodating electrical instruments such as
piezoresistive integrated into it.
• Silicon is an elastic material with no plasticity or creep below 800°C.
• It shows virtually no fatigue failure under all conceivable circumstances.
• These unique characteristics make it an ideal material for sensing and
actuating in MEMS microsystems.
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Mechanical Properties of Silicon
• It is a brittle material. Therefore, undesirable brittle fracture behavior with
weak resistance to impact loads needs to be considered in the design of
such microsystems.
• It is anisotropic, this makes accurate stress analysis of silicon structures
tedious, since directional mechanical property must be included. .
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Mechanical Properties of Silicon
• For most cases in microsystem design, the bulk material properties of
silicon, silicon compounds, and other active substrate materials
presented in table are used.
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Mechanical Properties of Silicon
• It can be observed from table that copper has the highest thermal
diffusivity, whereas, silicon and aluminum have about the same value.
• The silicon oxide conducts heat more than 150 times slower than silicon
and aluminum.
It observed that copper films are the best material for fast heat
transmission in microsystems, whereas silicon dioxide can be used as an
effective thermal barrier.
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Silicon Compounds
Following three silicon compounds are often used in microsystems:
SiO2 Silicon dioxide
SiC Silicon Carbide
Si3N4 Silicon Nitride
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Silicon Compounds
There are three principal uses
of silicon oxide in
microsystems:
(1) as a thermal and electric
insulator.
(2) as a mask in the etching of
silicon substrates. and
(3) as a sacrificial layer in
surface micromachining.
Silicon oxide has much
stronger resistance to most
etchants than silicon.
Silicon Oxide (SiO2)
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Silicon Compounds
Silicon dioxide can be produced by heating silicon in an oxidant such as oxygen with
or without steam.
Chemical reactions for such processes are:
Dry Oxidation (without steam):
Wet Oxidation (with steam):
The process can be accelerated to much faster rates by the presence of steam; the
highly activated H2O molecules enhance the process.
Silicon Oxide (SiO2)
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Silicon Compounds
Silicon Oxide (SiO2)
The team created silicon dioxide (SiO2)
nanotube anodes for lithium-ion
batteries and found they had over
three times as much energy storage
capacity as the carbon-based anodes
currently being used.
This has significant implications for
industries including electronics and
electric vehicles, which are always
trying to squeeze longer discharges
out of batteries.
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Silicon Compounds
The principal applications of silicon carbide (SiC) in microsystems are:
(1) its dimensional and chemical stability at high temperatures.
(2) It has very strong resistance to oxidation even at very high temperatures.
(3) Thin films of silicon carbide are often deposited over MEMS components to
protect them from extreme temperature.
(4) Using SiC in MEMS is that dry etching with aluminum masks can easily pattern
the thin SiC film. The patterned SiC film can further be used as a protective layer in
micromachining for the underlying silicon substrate, as SiC can resist common
etchants
Silicon exists in the raw materials of carbon (coal, coke, wood chips, etc.), the
intense heating of these materials in the electric arc furnace results in SiC sinking to
the bottom of the crucible.
Silicon Carbide (SiC)
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Silicon Compounds
(1) It provides an excellent barrier to diffusion of water and ions such as sodium.
(2) Its ultra strong resistance to oxidation and many etchants makes it suitable for
masks for deep etching.
(3) Applications of silicon nitride include optical waveguides, encapsulation to
prevent diffusion of water and other toxic fluids into the substrate.
(4) It is also used as high-strength electric insulators and ion implantation masks.
Silicon nitride can be produced from silicon-containing gases and NH3 in the
following reaction:
Silicon Nitride(Si3N4)
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Silicon Compounds
Silicon in polycrystalline form can be deposited onto silicon substrates by chemical
vapor deposition (CVD). It is a principal material in surface micromachining.
The low pressure chemical vapor deposition (LPCVD) process is frequently used for
depositing polycrystalline silicon onto silicon substrates. The temperature involved in
this process is about 600 to 650°C. Polycrystalline silicon is widely used in the IC
industry for resistors, gates for transistors, thin-film transistors.
Polycrystalline Silicon
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Essay Questions
• What is substrate / wafer?
• Explain substrate’s materials?
• Clarify the importance of silicon as substrate material?
• Define Miller Index and its use in Crystallography with diagrams?
• List the thermal diffusivities of silicon, silicon dioxide, aluminum, and
copper, and make an observation on the results?
• Explain the role of silicon dioxide (SiO2); silicon carbide (SiC); and silicon
nitride (Si3N4) in MEMS microsystems.
Fill in the blanks / MCQ Questions