📣Proud to announce that LPKF Laser & Electronics SE joined Onto Innovation's Packaging Applications Center of Excellence (PACE). PACE aims to develop seamless process integration and a secure supply chain to accelerate mass production of panel-level packages based on glass cores. These have become essential in the semiconductor architecture to meet the needs of demanding end applications like high-performance computing (#HPC), artificial intelligence (#AI), cloud computing and machine/deep learning 🦾 How we change glass based panel-level packaging together🚀 LPKF’s LIDE technology excels in micro-processing defect-free through glass vias (TGV) for advanced glass substrates. Onto Innovation’s Firefly system provides an automated inspection and metrology solution for advanced IC substrates and panel level packaging. Read more: https://lnkd.in/eQVMPaBS #semiconductor #AdvancedPackaging #GlassPackaging #innovation
