LIDE Technology: A Game-Changer in Advanced Packaging for the Industry

In the dynamic landscape of the semiconductor industry, industry technology leaders recent unveiling of their pioneering projects on glass substrates for advanced packaging has created quite a buzz on the topic in 2023.

Such a significant stride by major players in the industry emphasizes the paramount importance of continuous innovation, setting the trajectory for the next wave of computational advancements. While the properties of glass as a core substrate material have always been recognized, there's an established technology that has been setting new standards: LPKF's LIDE (Laser Induced Deep Etching) technology.

Benefits of Glass Substrates: The Advantages

Before we detail LIDE's unique glass processing capabilities, it's crucial to understand why glass as a core substrate material is so transformative, in comparison to legacy substrate materials:

• Ultra-low flatness
• Superior thermal and mechanical stability
• Enables larger form factors
• Significantly higher interconnect density
• Tunable CTE matching to silicon
• Unique electrical properties

These attributes are no incremental advancements; they redefine what's possible. They empower chip architects to design high-density, high-performance chip packages, with significant impact in applications that require high-performance computing, while also opening doors for advancements in others. As the industry grapples with the challenges of scaling transistors on silicon using organic materials, the unique properties of glass substrates emerge as the beacon guiding the way forward.

LIDE: LPKFs contribution to the Glass Substrate Revolution

The potential of glass as a substrate material was always recognized, but its application was hindered by processing technologies that were not cost-effective, lacked precision and repeatability, while producing low-quality results.

Having been a staple in the industry, LIDE boasts of:

• No Microcracks or Chipping: LIDE doesn’t add any types of defects to the glass, allowing all its properties – including mechanical ones – to be retained.
• Low TGV Sidewall roughness: the metallization and electrical properties of TGV highly benefit from smooth sidewalls.
• No Thermally-Induced Stress: LIDE operates at lower energy density levels which avoids thermal stress in the glass which is commonly the nucleates of defects and failure in glass.
• Limitless Design Freedom: LIDE technology provides designers with the freedom to unleash their creativity and innovate without restrictions.
• Aspect Ratio up to 1:50: Such a high aspect-ratio further underscores the design possibilities with LIDE, allowing for intricate and sophisticated designs.

In Conclusion: LPKF’s LIDE - Shaping the Future of Advanced Packaging

As trailblazers steer the industry into the future, technologies like LIDE stand ready to ensure that the journey is not only ambitious but also precise and efficient. It's a symbiotic dance between identifying groundbreaking materials and processing them with unparalleled quality and cost-effectiveness. And with LPKF's proven LIDE technology in the mix, the semiconductor industry is all set to redefine what's deemed possible in advanced packaging.

Let's innovate together, shaping the future of our industry! Learn more about LIDE here: LIDE by LPKF