Brewer Science’s Post

Discover how Brewer Science's R&D shapes the future of technology by challenging today’s assumptions. Learn how collaboration with customers and persistent innovation led to breakthroughs like bottom antireflective coatings (BARCs) and the VersaLayer system. See how these innovations enhance markets including high bandwidth memory, 3DIC, MEMS, and power applications. Explore the roles of collaboration and persistence in driving technological advancements. https://hubs.li/Q02D5b7v0

📽️ 🌟 We’re thrilled to launch the second video in our series exploring key innovations in the UPSIDE project. In this latest video, 👏 Dante Gabriel Muratore walks us through CMOS technology within UPSIDE. CMOS (Complementary Metal-Oxide-Semiconductor) technology forms the backbone of modern electronics, enabling efficient and high-performance integrated circuits. 🚀✨ Our first video, featured 🙏 Tiago L. Costa providing a recap of our project's overall achievements and goals. If you haven't seen it yet be sure to check it out as well. 🌟 But that's not all... Get ready for the future! We’re continuously innovating, and you can expect more developments that will reshape the tech landscape. 🌐✨ #Delft University of Technology #CMOS #Innovation #Technology #FutureTech #Electronics #DeepTech #BrainResearch #Neurostimulation #FocusedUltrasound #HorizonEurope #EICPathfinder

Throwback from #RealIZM Cost-effective production of thermal infrared image sensors could open up new possibilities for the use of thermal imaging systems in automotive and security applications. Fraunhofer IZM has therefore developed robust processes in wafer-level packaging under vacuum for the hermetic encapsulation of large MEMS pixel arrays. With this method, the manufacturing process can be carried out up to 100 times faster. The RealIZM blog team spoke with Dr. Charles-Alix Manier, development engineer at Fraunhofer IZM, about the EU research project APPLAUSE and the potential of the packaging technology. You can read the interview again here: https://ow.ly/q6xV50Tt2cF #NewsfromRealIZM #FraunhoferIZMBerlin #WaferLevelPackaging #MEMS

💡💡💡Our work with Fraunhofer IZM and Fraunhofer ENAS at the new 𝗖𝗵𝗶𝗽𝗹𝗲𝘁 𝗖𝗲𝗻𝘁𝗲𝗿 𝗼𝗳 𝗘𝘅𝗰𝗲𝗹𝗹𝗲𝗻𝗰𝗲 (#CCoE) is picking up speed! In the last few weeks, we have managed to reach the first 𝗺𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲 that we set out to achieve together: The first panel for the necessary characterization of our further chiplet work has been finalised at Fraunhofer IZM in Berlin (big thanks). This means that we are still firmly focused on our plan to actively promote the introduction of #chiplet technology in Europe with strong industrial partners. 🗓 To this end, we will next be bringing together around 20 industry representatives from the #automotive 𝘃𝗮𝗹𝘂𝗲 𝗰𝗵𝗮𝗶𝗻 for a workshop in Dresden on September 5, 2024. Here, we will not only present the panel demonstrator, but also give the participants a detailed insight into our work to date and set out the next milestones. Our aim is to form a 𝗽𝗲𝗿𝗺𝗮𝗻𝗲𝗻𝘁 𝗰𝗼𝗻𝘀𝗼𝗿𝘁𝗶𝘂𝗺 with key partners from this industry network before the end of this year, whose very specific requirements and use cases will guide our research roadmap at the CCoE over the next two years. ✅ Read more on CCoE on: https://lnkd.in/ehRc5pg3 Andy Heinig FMD - Forschungsfabrik Mikroelektronik Deutschland Fraunhofer IIS #semiconductor #electronics

📢 Join us for an exclusive 𝐈𝐌𝐁-𝐂𝐍𝐌 𝐭𝐚𝐥𝐤: 𝐈𝐧𝐭𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧 𝐭𝐨 𝐚𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐏𝐂𝐁 𝐭𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐞𝐬 𝐟𝐫𝐨𝐦 𝐒𝐜𝐡𝐰𝐞𝐢𝐳𝐞𝐫 As part of the SCAPE - Powering e-mobility project, we are pleased to invite you to an insightful session with Thomas Gottwald, Chief Technology Officer of Schweizer Electronic AG and member of the SCAPE project advisory board. 🗓 Date: Monday, 15 July 🕚 Time: 11:00 am 📍 Location: Institut de Microelectrònica de Barcelona (IMB-CNM, CSIC) Schweizer Electronic AG is at the forefront of #PCB technology, offering cutting-edge solutions and consulting expertise. With state-of-the-art manufacturing facilities and strategic partnerships with other technology leaders, SCHWEIZER provides customised PCB and embedding solutions. Their innovative technologies are used in high demand sectors such as Automotive, Aerospace, Industrial & Medical and Communications & Computing, and are renowned for their exceptional quality, energy efficiency and environmentally friendly features. What you can expect: 🔹 An overview of the key PCB technologies available for research applications. 🔹Insights into the latest developments in the PCB industry. 🔹A chance to learn from an industry expert and understand how advanced PCB technologies can power the future of e-mobility. This session is a fantastic opportunity for researchers, industry professionals and stakeholders to gain valuable knowledge from a leader in PCB technology. SCAPE is funded by the European Union (#HorizonEurope) and coordinated by IREC - Institut de Recerca en Energia de Catalunya. Our partners include Università degli Studi di Modena e Reggio Emilia, @Bax, DEEP Concept, AVL, ISINNOVA, Universitat Politècnica de Catalunya and Institut de Microelectrònica de Barcelona (IMB-CNM, CSIC). #technology #innovation #emobility #sustainability #research

The results of our latest MEMS switch with SiN waveguides are now published in JLT!

We are proud to be part of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe. 🚀 This initiative aligns with the ambition of the EU Chips Act, which seeks to bolster EU semiconductor capabilities and ensure technological sovereignty. The pilot line is coordinated by CEA-Leti. Over the past years, we have strengthened our competence in the field of #microsystems, focusing on thin films techologies, magnetic microsystems, piezolelectric microsystems and integrated photonics. 🌐 In our SAL #MicroFab, our 1,100m² research #cleanroom in Villach, we will continue to work on innovative technologies and grow our R&D #infastructure even further. We are excited to bring our expertise to this international consortium and important EU project. Our participation in FAMES includes various research areas of SAL: Microsystems, #Intelligent #Wireless Systems and #Heterogeneous #Integration Technologies. 🔑 The pilot line will be accessible to all EU stakeholders (universities, RTOs, SMEs and industrial companies) and all like-minded countries through annual open calls and upon request, following a fair and non-discriminatory selection process. The FAMES Consortium brings together an outstanding group of partners: CEA-Leti (France), imec (Belgium), Fraunhofer Mikroelektronik (Germany), Tyndall National Institute (Ireland), VTT (Finland), CEZAMAT WUT (Poland), Université catholique de Louvain (Belgium), Silicon Austria Labs (SAL) (Austria), SINANO Institute (France), Grenoble INP - UGA (France) and the Universidad de Granada (Spain). 📍 Learn more: https://lnkd.in/dRqQKvXE #EUChipsAct #ChipsJU #innovation #europe #technology #cooperation

New Year, New Achievement, New Energy! 🌟 I am thrilled to share that two of our papers have been accepted for presentation at the prestigious 9th IEEE Electron Device Technology and Manufacturing (EDTM'25) conference held in Hong Kong, China this year! 🎉 1️⃣ "A Novel De-Mirroring Approach for Bias-dependent Capacitance Extraction in Nanosheet FET using Conformal Mapping" 2️⃣ "Self-heating and Process Induced Performance Barrier on Complementary Field Effect Transistor: A Reliability Perspective" As the first author of the first paper, I am especially proud of this work, where we proposed a novel de-mirroring approach for bias-dependent capacitance extraction in Nanosheet FETs (NSFETs). Our innovative method addresses the limitations of traditional mirroring techniques and achieves improved accuracy in capacitance modeling. I am grateful to my mentor Dr. Navjeet Bagga and Prof. Sudeb Dasgupta sir for their valuable guidance during this work.  I would also thank to my senior Sandeep Kumar, Dr. Sunil Rathore sir for thier continuous support during this time. Through this journey, I explored and gained expertise in: 🔹 Advanced Semiconductor Device Modeling: Developing and validating models for bias-dependent capacitance in NSFETs. 🔹 Analytical Techniques: Leveraging conformal mapping and elliptical integration to address complex capacitive networks. 🔹 Bridging Theory and Practice: Translating theoretical concepts into practical solutions for real-world challenges in nanoscale device design. 🔹 Performance Optimization: Understanding the impact of device parameters like gate length, extension regions, and parasitic capacitances on overall performance. Here’s to a bright and innovative 2025! ✨ #Research  #EDTM'25  #IITBhubaneswar  #Semiconductors #CapacitanceModeling #EmergingTechnologies #Teamwork

GRAND CHALLENGES ACROSS THE SEMICONDUCTOR VALUE CHAIN IPSR-INTERNATIONAL 2024 SPRING MEETING June 5-7, 2024 MIT, Room 6-120, Cambridge, MA The IPSR-International: Integrated Photonics System Roadmap promotes synchronous, self-consistent solutions for the electronic-photonic manufacturing value chain. For the first time in more than 40 years, the semiconductor industry is confronted with limits to transistor size, to its environmental footprint, and to its workforce pipeline readiness. The ecological impact of exponential growth in performance and market size has introduced roadblocks for materials use, energy consumption and end-of-life disposal. FUTUR-IC is a global academic/industry alliance tasked to maintain continued progress of the Semiconductor Manufacturing and Information Systems industry with a 3-dimensional scaling paradigm for technology, ecology, and workforce solutions. The charter for this meeting is construction of the growth path for the next 40 years of Information Technology hardware, with concurrently engineered, technology-ecology-workforce solutions. REGISTRATION ENDS MAY 31st. https://lnkd.in/eZUEUaSD

In alignment with UN Sustainable Development Goal 9, it is crucial to develop advanced spintronic technologies for low-power, beyond-CMOS devices. In this Focus Issue, we discuss the challenges and potential solutions in spintronics for neuromorphic computing, STT-MRAM, and logic applications and encourage the exploration of emerging materials and devices for low-power spintronics, such as two-dimensional magnets. We also highlight the importance of integrating spintronic devices with existing silicon platforms and fostering collaboration between academia and industry. https://lnkd.in/ec9q-Bty