TechBlick

How to print (almost) any material or alloy from solid form directly on any substrate without formulations, solvents, curing etc, achieving properties close to bulk? Here you can learn about the innovative process developed by NanoPrintek, Inc. which enables exactly this based on lased-induced nanoparticle generation from a solid target as well as laser sintering - all integrated in a system that performs digital nozzle-based printing! This is an exciting machine that will be showcased in Boston. Come and see it in action - https://lnkd.in/gQKjBZzn Masoud Mahjouri-Samani, PhD #LaserPrinting #AdditiveElectronics #3DPrinting #PrintedElectronics #Disruption #TechBlick #ElectronicsRESHAPED

Air-stable cupper-nickel complex inks for Printed Electronics - don't miss Dr. Takeo Minari from Priways presenting at TechBlick's Future of Electronics RESHAPED USA in Boston on 11 and 12 June 2025. This is the ONLY event in the USA dedicated to the Additive, Sustainable, Hybrid, Wearable and 3D Electronics industry. What comes next in this field is already showcased here -> https://lnkd.in/gQKjBZzn Join 550 attendees from around the world to enjoy a world-class programme featuring 70+ onsite talks, 75 live exhibitors, 8 masterclasses, and 3 tours. Learn about the agenda and full programme here --> https://lnkd.in/gQKjBZzn Let's RESHAPE the Future of Electronics together, making it additive, sustainable, flexible, wearable, textile-based, R2R, soft, stretchable, 3D, etc. Register NOW before the early birds end on 25 April and join us in Boston - where the global additive, printed and 3D electronics community connects No other event in the world offers a more comprehensive and cutting-edge program and experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED events. #AdditiveElectronics #FlexibleElectronics #PrintedElectronics #SustainableElectronics #3DElectronics #WearableElectronics #HybridElectronics #InMoldElectronics #GreenElectronics

Can you laser print (dry, inkless) high-T tungsten on ceramics? What about copper on low-T FR4? Join us in Boston in June where the global additive electronics industry meets and see this machine in action. Check out the program here NOW https://lnkd.in/gQKjBZzn NanoPrintek, Inc.

Check out this article on state of the art process innovations in additive and 3D electronics moving towards ever fine lines at higher viscosities and faster throughputs in both digital and analog printing - with or without inks!

Scalable Subtractive R2R Process for Producing Multi-Layer Polymer and Metal Nano/Micro-Patterned Films - don't miss Dennis Slafer from MICROCONTINUUM, INC., presenting at TechBlick's Future of Electronics RESHAPED USA in Boston on 11 and 12 June 2025. This is the ONLY event in the USA dedicated to the Additive, Sustainable, Hybrid, Wearable and 3D Electronics industry. What comes next in this field is already showcased here -> https://lnkd.in/gQKjBZzn Join 550 attendees from around the world to enjoy a world-class programme featuring 70+ onsite talks, 75 live exhibitors, 8 masterclasses, and 3 tours. Learn about the agenda and full programme here --> https://lnkd.in/gQKjBZzn Let's RESHAPE the Future of Electronics together, making it additive, sustainable, flexible, wearable, textile-based, R2R, soft, stretchable, 3D, etc. Register NOW before the early birds end on 25 April and join us in Boston - where the global additive, printed and 3D electronics community connects No other event in the world offers a more comprehensive and cutting-edge program and experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED events. #AdditiveElectronics #FlexibleElectronics #PrintedElectronics #SustainableElectronics #3DElectronics #WearableElectronics #HybridElectronics #InMoldElectronics #GreenElectronics

TechBlick the leading platform for training, networking and learning on emerging technologies is delighted to welcome Kimoto Tech, Inc. as global 2025 silver exhibitors. The TechBlick community has over 1500 members and 95 exhibitors - For further information visit www.TechBlick.com Kimoto Tech, Inc. will be exhibiting at The Future of Electronics RESHAPED. A global Conference & Exhibition in Boston, USA on 11 & 12 June and in Berlin, Germany on 22 & 23 October 2025. 🌟 These are the most important upcoming industry events for Additive, Sustainable, Flexible, Hybrid, Wearable, Textile, Structural, R2R and 3D Electronics.🌟 For further information and to register for Boston or Berlin (Our largest attendee early bird discount ends 25 April) see here www.TechBlick.com Christoph Bosshard Rodrigo Pereira Menno Bos

🌟🌟Have You Registered Yet For Our Best Attendee Rate?| TechBlick The Future Of Electronics RESHAPED |Boston, USA | 11 & 12 June 2025🌟🌟 Our Best Early Bird Rates End On 25 April - Register Now https://lnkd.in/epPGTMy9 No other event in the world offers a deeper, more immersive experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's The Future of Electronics RESHAPED conferences and exhibitions - see https://lnkd.in/gQKjBZzn The upcoming curated program is our BEST yet, offering a carefully curated showcase of breakthrough innovations spanning materials, processes, manufacturing advancements, and real-world applications. Don't miss this opportunity to connect, learn, and RESHAPE the future of electronics, making it Additive, Sustainable, Hybrid, Wearable, and/or 3D. Join us in Boston - where the global Additive and 3D Electronics industry connects. 🌟🌟REMINDER: Our Best Early Bird Rates End on 25 April - Register Now https://lnkd.in/e-HrVbEH Rochester Institute of Technology NASA Goddard Space Flight Center Boeing Essemtec E Ink Corporation U.S. Army DEVCOM Army Research Laboratory Dracula Technologies Brewer Science Altium® Coatema Coating Machinery GmbH Henkel Human Systems Integration, Inc. Panasonic Notion Systems Sun Chemical VTT. Nagase ChemteX Spark Biomedical Inc

Advancements in metallic particle development for next-generation printed electronics applications - don't miss Daniel LaCorte from Ames Goldsmith Corporation presenting at TechBlick's Future of Electronics RESHAPED USA in Boston on 11 and 12 June 2025. This is the ONLY event in the USA dedicated to the Additive, Sustainable, Hybrid, Wearable and 3D Electronics industry. What comes next in this field is already showcased here -> https://lnkd.in/gQKjBZzn Join 550 attendees from around the world to enjoy a world-class programme featuring 70+ onsite talks, 75 live exhibitors, 8 masterclasses, and 3 tours. Learn about the agenda and full programme here --> https://lnkd.in/gQKjBZzn Let's RESHAPE the Future of Electronics together, making it additive, sustainable, flexible, wearable, textile-based, R2R, soft, stretchable, 3D, etc. Register NOW before the early birds end on 25 April and join us in Boston - where the global additive, printed and 3D electronics community connects No other event in the world offers a more comprehensive and cutting-edge program and experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED events. #AdditiveElectronics #FlexibleElectronics #PrintedElectronics #SustainableElectronics #3DElectronics #WearableElectronics #HybridElectronics #InMoldElectronics #GreenElectronics

Welcome to Arkema 2025 Exhibitors, who will be exhibiting at TechBlick's The Future of Electronics RESHAPED. A global Conference & Exhibition in Boston, USA on 11 & 12 June and in Berlin, Germany on 22 & 23 October 2025. The Future of Electronics RESHAPED are the most important upcoming industry events for Additive, Sustainable, Flexible, Hybrid, Wearable, Textile, Structural, R2R and 3D Electronics. TechBlick is the leading platform for training, networking and learning on emerging technologies. We are delighted to welcome Arkema to our community of over 1500 members and 95 exhibitors - See www.TechBlick.com For further information and to register for Boston or Berlin (with the latest attendee discount ending 25 APRIL) see here www.TechBlick.com Mickaël Pruvost, Ph.D Fabrice Domingues Dos Santos

What are the particle size and viscosity trade offs and requirements when printing ultra fine features using high pressure capillary printing systems? Join the Additive and 3D Electronics industry at TechBlick's Electronics RESHAPED events in the USA (Boston, June) and Europe (Berlin, Oct) and let us reshape the future of fine feature deposition in electronics, semiconductor packaging and displays with printing Check out the Electronics RESHAPED US program in June: https://lnkd.in/gQKjBZzn Lets print the future! Frederic Raynal Sahar Al Kamand Hummink