confovis

Wir suchen Verstärkung bieten aktuell wieder spannende Karrieremöglichkeiten bei Confovis: 🔹 Vertriebsingenieur (m/w/d) 🔹 Applikationsingenieur (m/w/d) 🔹 Systemingenieur (m/w/d)🔹Werkstudent Software (m/w/d) 🔹 Interessiert? Weitere Informationen zu den offenen Stellen und gibt es hier:  https://lnkd.in/em9TyQkC 📄📢✨ #Jobs #Karriere #Confovis #Stellenangebot

Want to stay informed about the latest trends in optical 3D metrology and inspection? Our newsletter provides exclusive insights into: ✅ Cutting-edge metrology and inspection solutions & innovations ✅ Application examples & industry trends ✅ Insights into semiconductor & industrial surface inspection ✅ Updates on upcoming events & trade shows 📩 Sign up now to receive the next edition! 👉 Register here: https://lnkd.in/eczSBCTf The next issue will be sent out soon – don’t miss it! #Confovis #Newsletter #3DMetrology #Innovation #OpticalMetrology #Semiconductor

As MEMS devices become an ubiquitous part of our everyday life in smartphones for example, manufacturers need reliable systems for non-destructive inspection to assure quality in product development and manufacturing. 🛠️ MEMS-based LiDARs are trending right now towards fully autonomous systems in production facilities and vehicles. LiDAR has already been successfully applied in many fields of operation such as robotics navigation and land surveying. The emergence of Micro-optical MEMS and micro-mirrors is providing a promising solution to low-cost, reliable, and highly integrable LiDAR systems. 💡 A recent study published in Nature demonstrates how a LiDAR system with 360º x 8.6º (horizontal x vertical) field of view (FoV) was achieved with the combination of a MEMS micro-mirror mirror and a rotating platform. This MEMS-based LiDAR exhibits an angular resolution of 0.07º 0.027º (horizontal x vertical) which is 13.8 times better than commercial LiDAR sensors. 📈 The micro-mirrors used in MEMS LiDARs are photonics microsystems. They are fabricated on large diameter silicon wafers which require specific inline test equipment. The WAFERinspect AOI Dual system is of particular interest for MEMS in general, and for LiDARs specifically, as it can cope with topographies ranging from few nm to mm on the same wafer. Thanks to the two high-end sensors equipping this new automatic optical inspection system can perform a full 3D scan of wafers up to 300 mm within to 2 to 3 minutes followed by a 100% 3D defect and anomaly inspection with single nm accuracy. 🔍 ➡️➡️Read more about LiDAR Inspection: https://lnkd.in/dpF4AFja

In advanced wafer metrology and surface inspection, precision is everything. Structured Illumination Microscopy (SIM) provides a robust, material-independent solution for inspecting challenging surfaces such as polished semiconductors, glasses, epitaxial layers, oxides, and metals. Unlike conventional confocal microscopy, SIM achieves high-resolution 3D topography and intensity imaging without the need for pinholes, lasers or moving parts. This unique approach enables: ✅ Nanometer-precision surface scannnig with an accuracy better than 3 nm across a wide range of materials. ✅ High-speed imaging – Capture 60 confocal frames per second for fast and reliable inspection. ✅ Efficient optical sectioning – Acquire 120 optical sections in just 2 seconds, covering a height of 20 μm. This technology is revolutionizing semiconductor manufacturing, ensuring that even the most challenging surfaces can be measured with unprecedented precision and efficiency. How do you see SIM addressing the challenges of next-generation semiconductor manufacturing? Let’s discuss in the comments! 👇 #Microscopy #Confocal #Semiconductors

Last week, our colleagues Frank and Alessandro had the opportunity to visit Silicon Austria Labs (SAL) in Villach, where they met with Lisa Kainz and Mohssen MORIDI to exchange insights on the latest advancements in advanced packaging, MEMS, and photonic integrated circuits (PICs). The discussions centered around how Confovis’ high-precision optical inspection and metrology solutions can support cutting-edge semiconductor research and prototyping. From AI-assisted defect detection to process optimization, pushing the limits of inspection technology is key to enabling the next generation of semiconductor innovation. A big thank you to Lisa, Mohssen, and the entire SAL team for the warm welcome and insightful discussions! We look forward to continued collaboration and driving innovation in semiconductor inspection together. #Confovis #SiliconAustriaLabs #Semiconductor #Metrology #AOI #AdvancedPackaging #MEMS #Photonics

In the last decades, advances in micro- and nano-manufacturing techniques have led to the miniaturization of components in various fields such as electronics, fluidics, and optics. As a result, novel subfields have emerged: microelectronics, microfluidics, and microoptics. One of the most remarkable innovations comes from the integration of micro-optical devices on MEMS. The resulting components are known as optical MEMS or MOEMS (micro-opto-electrical systems). ✨ Microlenses and microlens arrays (MLA) have become an indispensable element in many optical systems. They are among the key components for the next generation of 3D imaging systems. Thanks to their miniaturization, high integrability, large field of view, and low phase difference, microlenses and MLAs play an important role in imaging, sensing, and light emitting diodes (LED). Microlenses and MLAs are used widely in civil, defense, security, aerospace, and biomedical fields. One of the main challenges in manufacturing microlenses and MLAs is to obtain a good uniformity on large surface areas such as wafers up to 300 mm. ✅ The WAFERinspect AOI Dual is an automated optical inspection (AOI) tool with two high-end sensors for semiconductor manufacturing inspection. It can perform a full 3D scan of a 300 mm wafer within 2 to 3 minutes. This allows a fast 3D defect and anomaly inspection. It is of particular interest for the inspection of micro-optical components such as micro-lenses and micro-lens arrays for LiDAR applications. 👉 Learn more about the WAFERinspect AOI Dual Tool: https://lnkd.in/eYHUJYH5 #AOI #MicroOptics #Microlenses #MOEMS #QualityInspection #Wafer #3DImaging #LiDAR #Semiconductor

In the rapidly evolving world of semiconductor manufacturing, precision and reliability are essential to maintain high yield and product performance. By integrating Automated Optical Inspection (AOI) with metrology, we provide a single platform that ensures seamless defect detection and review in one tool. Our AI-driven defect analysis combined with our patented Structured Illumination Microscopy (SIM) technology, delivers sub-micron accuracy while increasing productivity and reducing operating costs.   🔹 One Beam Path for Metrology and AOI Confovis systems use a single beam path for defect inspection and review including 3D metrology, ensuring consistency and eliminating positioning discrepancies. 🔹 AI-Powered Defect Classification Our advanced AI algorithms detect, classify, and adapt to evolving defect patterns, minimizing false positives and false negatives. 🔹 Dual-Sensor System for Comprehensive Inspection On top of the 2D defect inspection we have a platform with an additional high-speed chromatic line sensor. This allows 3D full-wafer scans in just 2–3 minutes, followed by detailed high-resolution 3D defect inspection. This ensures efficient analysis of complex wafer structures, especially in applications like 3DICs, MEMS, and photonics. 🔹 Scalability and Flexibility Confovis tools are designed to adapt, whether for manual, semi-automated, or fully automated workflows. With multisensor upgrade options, our systems evolve with your production needs, ensuring long-term value. 🔹 High Stability and Throughput With continuous path motion control, our systems provide stable and reliable wafer scanning, even for multi-layer structures, improving inspection speed without sacrificing accuracy.   Designed for Advanced Semiconductor Applications ✅ Photonic Integrated Circuits (PICs): Ensuring alignment and defect-free optical surfaces. ✅ MEMS Devices: Detecting structural deformations, micro-cracks, and contamination. ✅ Power Semiconductors: Identifying scratches, particles, and edge defects in high-performance components. ✅ 3DICs and Advanced Packaging: Ensuring precise bump heights, interconnect integrity, and TSV quality for multi-layer technologies.   More Than a Technology Provider – A Trusted Partner With Confovis, you are not just investing in an inspection tool, you gain a strategic partner committed to improving yield, reducing waste, and optimizing semiconductor production. 🚀 Get ready to take your wafer inspection process to new heights! Visit our new Wafer Inspection webpage today and discover how Confovis can transform your production line. 👉 https://lnkd.in/dJujTff4 #WaferInspection #AOI #Semiconductors #AI #MEMS

🎯 Revolutionizing Precision and Consistency in Wafer Inspection At Confovis, we have developed a groundbreaking approach to wafer inspection: One Beam Path technology, which combines Automated Optical Inspection (AOI) and 3D area scanning metrology in a single beam path. This innovation eliminates the discrepancies often found between separate imaging and measurement processes. The operator not only saves personal time, but also the tool time of one or more tools involved in defect inspection and review. 🔬 Why Does One Beam Path Matter? In traditional systems, separate beam paths for defect detection and metrology often lead to inconsistencies that affect the accuracy and reliability of wafer analysis. Confovis eliminates these problems by using a single beam path for both processes, streamlining workflows and enanbling: 🔹Data Consistency; 🔹Enhanced Precision; 🔹Improved Workflow Efficiency. 🔑 Key Features of the One Beam Path Technology 🔹Integrated AOI and Metrology in a single step without the need to switch between systems or recalibrate. This ensures consistent results for tasks like overlay metrology and on-the-fly wafer inspection. 🔹Continuous-Path Motion Control for 2D metrology leads to unparalleled stability enabling uninterrupted scanning and precise measurements. 🔹Flexibility of the system to adapt seamlessly to the complexity of modern semiconductor production lines. 🚀 Why Choose Confovis? With our One Beam Path innovation, we provide: 🔹Unified Processes to ensure accurate defect detection and metrology. 🔹Early Detection of Defects to identify process excursions early and optimize production yield. 🔹Flexibility and Scalability to grow with your manufacturing needs. Confovis tools are more than inspection systems. They are a comprehensive solution to meet the challenges of advanced wafer processing. Discover how Confovis is driving innovation in semiconductor manufacturing with the One Beam Path technology. 👉 Visit our new Wafer Inspection webpage to learn more: https://lnkd.in/eRkYqUVB #WaferInspection #AOI #Semiconductors #Innovation #Confovis #Metrology

🤖 Confovis leverages artificial intelligence (AI) to take wafer inspection to the next level. How is AI transforming Wafer Inspection? 🍎 AI-Driven Classification minimizes false positives and enhances decision-making for process optimization. 🍐 Object Detection – With advanced algorithms, AI identifies, localizes , and defines the boundaries of defects. 🍑 Segmentation – AI can identify and separate areas of interest, such as defects, surface strutures, or critical design elements, from the surrounding regions. 🍋 Detection of Anomalies identifies irregularities or unexpected patterns that deviate from the learned norm. Leveraging unsupervied learning, AI can detect anomalies without prior labeling or pre-defined defect classes. What does AI bring to Wafer Inspection Improved Detection Accuracy – AI can detect even the smallest and most subtle defects that traditional metods might miss. Enhanced Classification – AI categorizes defects into groups, enabling you to focus on resolving the most impactful issues efficiently. Accelerated Throughput – With automated defect analysis, inspection times are significantly reduced, leading to faster production without sacrificing quality. Adaptive Learning – Through continuous data analysis, Confovis systems can evolve and adapt to new and changing defect patterns, ensuring flexibility in high-variation environments. Built for Advanced Semiconductor Manufacturing From photonics and MEMS to power semiconductors and 3DICs, AI-driven inspection ensures precision and efficiency. Whether you are addressing structural anomalies or fine-tuning dimensional metrology, our AOI tools keep your manufacturing processes one step ahead. Find out more about our Wafer Inspection Solutions: https://lnkd.in/eTNAbCex

At Confovis, we are redefining wafer inspection to meet the demands of advanced semiconductor manufacturing. By integrating Automated Optical Inspection (AOI) and metrology into a single, powerful platform, we bring unmatched precision, efficiency and reliability to your production processes. Our patented Structured Illumination Microscopy (SIM) technology sets us apart. This groundbreaking innovation enables sub-micron accuracy, providing high-speed, high-resolution defect detection for even the most complex applications, including photonic integrated circuits (PICs), MEMS devices, and 3DICs. Redefining Precision and Reliability ☝️ One Beam Path for All: Streamline your workflow with a unified beam path for both defect inspection and metrology. Eliminate discrepancies and achieve perfect alignment in every step of the process. ✌️ Dual-Sensor Systems: A high-speed chromatic line sensor rapidly scans wafers followed by a high-resolution 3D defect inspection scan with the Confocam® confocal column, ensuring accurate and efficient analysis of complex wafer structures. 🤖 AI-Powered Defect Classification: Leverage the power of artificial intelligence to detect, analyze, and classify defects and anomalies with unmatched accuracy. Our tools are designed not just to meet today’s challenges but to anticipate tomorrow’s needs. Whether you’re working with photonics, advanced packaging, or power semiconductors, Confovis systems deliver the results you need to stay ahead in the fast-paced semiconductor industry. 📈 Improve yield. 📉 Reduce waste. 🔧 Optimize processes. Ready to transform your inspection processes? Visit our new Wafer Inspection webpage to learn more:  https://lnkd.in/duy7EQTt #WaferInspection #Semiconductors #Innovation #Confovis #Precision #AOI #confocal