SMT basic noun explanation (B)
Ball grid array: A form of packaging for an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the underside of the component.
Blind via: An electrically conductive connection between the outer and inner layers of the PCB that does not continue to the other side of the board.
Bond lift-off: A failure to separate solder pins from the pad surface (board substrate).
Bonding agent: A glue that bonds a single layer to form a multilayer board.
Bridge: A solder that connects two conductors that should be electrically connected to each other, causing a short circuit.
Buried via: An electrically conductive connection between two or more inner layers of a PCB (ie, invisible from the outer layer).