Revolutionizing Flexible Printed Circuit Board (FPC) Stamping with Horizontal Fully-Automatic Decoiler Machines

In modern electronics manufacturing, precision and efficiency are critical when stamping delicate components like flexible printed circuit boards (FPCs). Traditional decoiler systems used in FPC stamping lines often struggle with fragile copper foil handling, inconsistent winding lengths, and manual intervention – challenges that directly impact production quality and costs. Enter Henli’s Horizontal Fully-Automatic Decoiler Machine, engineered to transform FPC stamping workflows with intelligent automation.

Industry-Specific Pain Points in FPC Stamping

1. Material Breakage Risks: Thin copper foil (0.05-0.1mm) used in FPCs is prone to tearing during high-speed winding. Conventional decoilers lack real-time breakage detection, risking machine jams and costly downtime.
2. Manual Length Control: Human-dependent length measurement leads to uneven FPC coil sizes, complicating downstream SMT assembly processes.
3. Labor-Intensive Operations: Frequent manual coil changes and cutting in 24/7 production lines increase labor costs by 30% while reducing throughput.

Precision-Driven Design for FPC Production Henli’s decoiler integrates industry-first features tailored for ultra-thin material handling:

• Dual-Turret Continuous Operation: Two independently controlled turrets alternate between winding completed FPC coils (up to Φ800mm) and loading fresh cores without stopping the stamping press. This achieves 98% equipment utilization in EMI-shielded FPC lines.
• Laser-Based Tension Control: Patented optical sensors maintain 0.15-0.3N/mm² tension range during copper foil winding, preventing material deformation critical for 5G antenna FPCs.
• Auto-Length Preset System: Programmable logic controllers (PLCs) enable ±1mm length accuracy across 10-500m coils, ensuring compatibility with reel-to-reel plating systems.
• Interleaving Paper Integration: Automated 25μm PET separator film insertion prevents surface scratches on high-density FPC circuits (50μm line width).

Case Study: High-Mix FPC Manufacturer A Shenzhen-based FPC supplier reduced material waste by 18% and increased stamping line speed to 45m/min after implementing Henli’s system. The machine’s automatic fault response eliminated 3.5 hours/week of unplanned downtime during 0.07mm polyimide substrate processing.

Why Electronics Manufacturers Choose Henli

• Smart Collision Avoidance: Strain gauge sensors halt operations within 0.8 seconds upon detecting abnormal resistance (≥15% fluctuation), protecting delicate FPC layers.
• IoT-Ready Architecture: OPC UA compatibility allows seamless integration with MES systems for real-time production tracking across multi-stage FPC lines.
• Energy-Saving Design: Regenerative braking reduces power consumption by 22% versus hydraulic decoilers during frequent start-stop cycles.

Technical Specifications for FPC Applications

• Max Coil Weight: 2000kg
• Material Width: 50-600mm
• Winding Speed: 5-60m/min (adjustable for rigid-flex PCB combinations)
• Core ID: Φ76mm/Φ152mm (customizable for reel-to-reel etching needs)

Upgrade your FPC stamping line with a decoiler that understands the precision demands of modern electronics. Contact Henli engineers today to optimize your copper foil handling process for high-reliability PCB manufacturing.