HDI (High-Density Interconnect) printed circuit boards - Toptek PCB

In recent years, HDI (High-Density Interconnect) printed circuit boards have developed rapidly. HDI PCBs are increasingly used in fields such as consumer electronics, smart medical care, new energy vehicles, and precision measurement. At the same time, as products become more intelligent, the difficulty of PCB manufacturing requirements has also increased.

Nowadays, 1-2 level Density HDI PCB can no longer meet the needs of many precision electronic products. There are more and more applications of high-density HDI structures above 3 levels of Density. This trend further promotes and accelerates the high precision of circuit boards. Development of production technology.

PCB high precision refers to the use of fine line width/spacing, tiny disk holes, special-shaped small pads, narrow ring width (or no ring width) buried, blind vias, and other micro-hole technologies to achieve high density. Its main purpose is Characterized by "Finely, small, narrow, thin"

The result of high precision will inevitably bring higher requirements for PCB accuracy, which will pose greater challenges to the implementation of related production processes, and ultimately promote the continued development of many subsequent technologies;

Finely wire technology

In the future, the high-fine density line width/spacing of high-end HDI PCB will be based on

0.08MM-0.05MM-.025MM route for compression and advancement;

Become meet SMT and multi-chip packaging (MULITICHIP PACKAGE, MCP) requirements. Based on the premise of high product reliability, Toptek PCB has the following technologies that have been applied in batches.

1: Thin substrate base material

Use thin or ultra-thin copper foil (<18UM) base material and fine table, and Surface processing technology.

2: Process capability

Using thin dry film and wet film technology. Thin and high-quality dried membrane reduces line width distortion and defects. Wet film fills small air gaps. Increase interface adhesion and improve wire integrity and accuracy.

3: Electrode-posited photo-resist film

Using electrode-posited photo-resist film (ELECTRO-DEPOSITED PHOTORESIST, ED). The thickness is controlled in the range of 5~30UM to ensure to production of more perfect fine wires.

4: LDI exposure technology

Using film-free LDI technology. Can get unlimited access to users

Design tiny wires with line widths to ensure extremely high precision in line width dimensions and edge finish.

1) Micro-via (buried, blind via) technology;

Buried, blind, and through-hole combination technologies also improve the density of printed circuits.

An important way to scale. Generally, buried and blind holes are tiny holes.

In addition to increasing the number of wiring on the board, buried and blind holes are

Use "nearest" interconnects between inner layers to greatly reduce the number of vias formed

quantity, the isolation plate settings will also be greatly reduced, thereby increasing the number of

The number of efficient wiring and inter-layer interconnections increases the density of interconnections.

Toptek PCB uses imported Mitsubishi drilling rigs and high-precision CNC drilling rigs

The machine is combined with the blind hole electroplating process and the VCP copper filling production line.

Electroplating fills micro-blind holes to achieve 2-4MIL micro-hole precision and high reliability.

Toptek focuses on high-layer PCB projects, special material PCB projects, and fast-turn service.

If you have PCB demands, warm welcome to contact me.

Thank you,

www.toptekpcb.com

anna@toptekpcb.com