We're thrilled to unveil a new automated and certified workflow for TSMC's InFO packaging technology, powered by Siemens' industry-leading advanced packaging integration solutions. 🎉 This collaboration addresses the growing challenges of design complexity and time-to-market, empowering our mutual customers to achieve remarkable innovations. As AJ Incorvaia, SVP of Electronic Board Systems at Siemens, puts it, "The combination of Siemens’ industry-leading Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.” This workflow, featuring Xpedition Package Designer, HyperLynx DRC, and Calibre nmDRC, streamlines the design process for TSMC's InFO_oS and InFO_PoP technologies. It's a testament to our commitment to the TSMC Open Innovation Platform® (OIP) and our dedication to providing cutting-edge solutions for next-generation semiconductor designs. #Semiconductor #Innovation #ChipDesign
Learn more about this game-changing collaboration and how it's shaping the future of AI, HPC, and mobile applications: https://sie.ag/8Mu9y