The MMEC is proud of our members and their efforts to accelerate hashtag #microelectronic technologies that deliver solutions to establish a trusted and resilient domestic supply chain for the benefit of National Security and economic dominance. As the demand for computing power skyrockets with the rapid rise of AI and ML computing, new tools are needed in the semiconductor packaging and Ultra High-Density Interconnect (UHDI) toolbox. At the heart of LQDX portfolio lies LMIx® – or Liquid Metal Ink technology – a novel metallization chemistry suite that enables the production of circuits up to 250 times denser than conventional Printed Circuit Boards (PCBs). These advanced features, previously exclusive to silicon, are essential to meet the exponential growth demand in signal density required by advanced chips and Chiplets. As an alternative to highly expensive wafer processing which uses Physical Vapor Deposition (PVD) technology, LMIx® is simple PVD-in-a-BottleTM substitute that integrates seamlessly into existing infrastructure. Learn more at lqdx.com
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