IntelliSense Software’s Post

Last week Okmetic participated in the 15th annual MEMS Engineering Forum (MEF) held in Tokyo, Japan. Our Customer Support Manager Dr. Akiko T. Gädda held an insightful speech on “Advanced Silicon Wafers for Optimized MEMS Devices” giving a comprehensive overview on Bonded Silicon-On-Insulator (BSOI), Cavity SOI (C-SOI®) and Engineered High Resistivity wafers.    At the event, we also had a chance to have many interesting conversations with MEMS researchers, developers, and engineers from around the world. For more information on Okmetic SOI and RFSi® silicon wafers, please see the links in the comments section. #semiconductor #silicon #MEMS Martti Palokangas TOMOYUKI TAKAHASHI Masayoshi Nakamura Chieko Noda

Happy to share our recent publication on high harmonic generation from laser excited wide-bandgap semiconductor materials. The experimental and simulation work is an outcome of industry academia collaboration. https://lnkd.in/d96URvqE #Semiconductor #Materialscience #Ultrafast https://lnkd.in/dtYkZF73

The IEEE EPS - IEEE Electronics Packaging Society is organizing the IEEE Hybrid Bonding Symposium - Enabling Hybrid Bonding Commercialization on 16-17 January 2025 at the SEMI HQ in Milpitas, CA! See the prelimary agenda at https://lnkd.in/gRrUauZX Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Registration is now open: https://lnkd.in/gh4n6GEV SIGN UP TODAY! (Early-bird rates through Dec. 20th) William Chen Ravi Mahajan Paul Wesling Paul Trio Annette Teng Benson Chan Nancy Stoffel Applied Materials TOKYO ELECTRON LIMITED Adeia Sigray, Inc. Besi Netherlands B.V. EV Group Brewer Science Beth Keser, Ph.D. Patrick Thompson David McCann Eric Perfecto Alan Huffman Denise Manning Manfred (Fred) Schindler Dalma Novak Don Tan

Earlier this year, SHIFT partners IMS Laboratory and STMicroelectronics presented SHIFT with a conference publication during the 2024 8th IEEE Electron Devices Technology & Manufacturing Conference #EDTM2024 in Bangalore, India SHIFT was presented with a publication titled “Next Generation SiGe HBTs for Energy Efficient Microwave Power Amplification” The 8th IEEE Electron Devices Technology & Manufacturing Conference EDTM 2024 took place in Bangalore, bringing together global leaders in electron device technology and manufacturing. With a focus on bridging academic research and industrial applications, EDTM 2024 featured technical presentations, interactive workshops, and valuable networking opportunities. Learn more here: https://lnkd.in/dvnf8cgA

sn-news: #es #electronics #semiconductors #rdi #manufacturing #funding #chipnation My view on the 2nd ChipNation Congress session: “Opportunities and Needs in the Semiconductor Ecosystem”

Want to hear Victor Veliadis thoughts on electron trapping in the #SiC/gate‑oxide interface, how they degrade mobility and cause threshold voltage instability? Victor also shares some potential solutions to overcome these challenges #ALE #ALD Get your free digital #SemiInterface magazine

Our paper titled “𝘊𝘳𝘺𝘰𝘨𝘦𝘯𝘪𝘤 𝘚𝘮𝘢𝘭𝘭 𝘋𝘪𝘮𝘦𝘯𝘴𝘪𝘰𝘯 𝘌𝘧𝘧𝘦𝘤𝘵𝘴 𝘢𝘯𝘥 𝘋𝘦𝘴𝘪𝘨𝘯-𝘖𝘳𝘪𝘦𝘯𝘵𝘦𝘥 𝘚𝘤𝘢𝘭𝘢𝘣𝘭𝘦 𝘊𝘰𝘮𝘱𝘢𝘤𝘵 𝘔𝘰𝘥𝘦𝘭𝘪𝘯𝘨 𝘰𝘧 𝘢 65-𝘯𝘮 𝘊𝘔𝘖𝘚 𝘛𝘦𝘤𝘩𝘯𝘰𝘭𝘰𝘨𝘺” has been published in the prestigious Journal of Electron Device Society (J-EDS) and is now fully available (OA) on IEEE Xplore. This work presents the most extensive cryogenic temperature characterization in 65-nm technology to date available in literature, with the point of view of a circuit designer. This is also reflected in the proposed modeling approach, which aims for speed and robustness, but without sacrificing degrees of freedom in device sizing. This offers designers like me an immediate benefit in the challenging world of cryogenic analog circuits. This work is the result of the experience gained in the MICAS (KU Leuven) labs in cryogenics and condenses knowledge in several fields: from semiconductor device characterization, to cryogenic materials, to the design and fabrication of custom heatsinks and test platforms for extremely low temperatures. The development of all of this would not have been possible without the unwavering support of my promotor Filip Tavernier, who initiated this branch of research in our group and always supported my ideas for the development of our cryogenic test platforms, which are often only weakly related to the world of integrated circuits. For MICAS, this is the first milestone in our cryogenic CMOS circuit design roadmap, but more projects are in the pipeline to be published soon. Stay tuned! Link to the paper: https://lnkd.in/eWtWPXhp #IEEE #ElectronDevicesSociety #Cryogenic #CMOS

SAVE THE DATE: TUESDAY FEB 25th 2025: Revolutionizing PIC Packaging: Optica Industry Meeting on Mass Manufacturing. Join industry leaders at the upcoming Optica Online Industry Meeting on Photonic Integrated Circuit (PIC) Packaging for Volume Production, taking place on February 25, 2025. We start at 10 AM EST, 3 PM UK, 4 PM Central Europe. We will continue the discussion around the transformation of PIC packaging to meet the demands of mass manufacturing, drawing parallels with the advancements seen in CMOS microelectronics. This business meeting will examine ways to accelerate the wider adoption of PIC Technology. Sign up FREE to be in the Zoom room to be able to interact with others. https://lnkd.in/dvXTsSKr The meeting will focus on the critical need to move from specialized, low-volume processes to high-throughput, high-yield methods. Discussions will revolve around key challenges and strategies, including ·     Precision Alignment: Achieving the extremely precise alignment of optical components necessary for optimal PIC performance. ·     Thermal Management: Implementing effective techniques to manage heat generated by PICs, ensuring reliable operation. ·     Wafer-Level Processing: Exploring the shift towards wafer-level processes to increase throughput and reduce costs. Featured speakers at this meeting include: ·     Jeroen Duis (Chief Technology Officer at PHIX Photonics Assembly), with expertise in optical interconnects and PIC packaging ·     Douwe Geuzebroek (Chief Technology Officer at Brilliance RGB) ·     Nikolaus Flöry (Chief Technology Officer at vario-optics) ·     Kees Propstra (VP Global Sales & Marketing, GM US at Quantifi Photonics) ·     Rolando Ferrini (Chief Regional Officer & Head of FEMTOprint Neuchâtel at FEMTOprint SA) ·     Leili Shiramin, imec. ·     Travis Scott (Business Development Manager at Finetech) The meeting will be moderated by Jon Pugh (Director, Photonic Integrated Circuits and Quantum Technologies at Optica) and me. Don't miss this opportunity to be part of the conversation shaping the future of PIC manufacturing! #PICpackaging #photonics #integratedcircuits #massmanufacturing #Optica #innovation #technology

SEMICON WEST 2024 took place in San Francisco from July 9 to 11. The event featured presentations from representatives of Indiana, Arizona, and New York on semiconductor industry reshoring and job creation in the United States. While these states have diverse political leanings - Indiana typically Republican, Arizona a swing state, and New York generally Democratic - they all delivered a consistent message regarding reshoring: a commitment to fostering semiconductor manufacturing industries. Key technological issues highlighted at the event included the development of reducing agents for ALD (Atomic Layer Deposition) processes using AI, advancements in quantum computing, and innovations in advanced packaging. These topics underscore the industry's focus on pushing the boundaries of semiconductor technology and manufacturing processes. The Korea Trade-Investment Promotion Agency (KOTRA), a state-funded organization that promotes international trade and investment, organized the Korea Pavilion at SEMICON WEST 2024. This pavilion showcased over 10 Korean companies, highlighting the country's significant presence in the global semiconductor industry. Participants included: IMT (KOSDAQ: 451220), Haesung DS (KOSDAQ: 195870), Lake Materials (KOSDAQ: 281740), Hansol IONES (KOSDAQ: 114810), AIBIZ, Livingcare, Hanbaek Precision, Laserssel (KOSDAQ: 412350), RFPT, NTEK Systems, GP & E, and EMI YOUNG JIN IND. A comprehensive report exceeding 60 pages, detailing observations and insights from the three-day event, has been prepared. For those interested in accessing the full report, it is available at: https://lnkd.in/g3mkwvPJ This extensive report provides an in-depth analysis of the event, including the aforementioned key trends, technological advancements, and industry developments discussed at SEMICON WEST 2024.

Discover how Brewer Science's R&D shapes the future of technology by challenging today’s assumptions. Learn how collaboration with customers and persistent innovation led to breakthroughs like bottom antireflective coatings (BARCs) and the VersaLayer system. See how these innovations enhance markets including high bandwidth memory, 3DIC, MEMS, and power applications. Explore the roles of collaboration and persistence in driving technological advancements. https://hubs.li/Q02D5b7v0