ARI was well represented at GOMACTech 2025 this past weekend by our very own Benjamin Griffin! Ben co-chaired sessions on advanced RF components and thermally hardened microsystems, areas where his deep expertise and past work have helped lay the foundation for ongoing innovation. We're proud to have Ben contributing to these critical conversations and representing ARI’s commitment to advancing U.S. microelectronics capabilities!
Great to catch up with friends and colleagues at GOMACTech in Pasadena. While there I co-chair sessions on advanced RF components and thermally hardened microsystems, catching up on the latest in technologies I fostered in previous roles. I also joined an interesting panel conversation with Nicole Petta, Saverio Fazzari, Sapan Agarwal, and Vivian Kammler on dual use technologies. An intriguing topic covered by the panel was the challenge of creating asymmetric microelectronics hardware advantages from commercially scaled technologies.
