Siemens EDA (Siemens Digital Industries Software)

We're happy to announce that Secafy Co., Ltd., a hardware security company in Japan, has adopted our full IC design flow of our comprehensive portfolio of electronic design automation (#EDA) tools to develop next-generation hardware security large-scale integration (LSI) devices. In addition to using our Aprisa digital implementation solution, Secafy also uses a range of tools across our comprehensive integrated circuit (IC) design flow including Calibre software, Solido Simulation Suite software, Solido Design Environment software and Custom IC Design software, to design LSI devices to be built using 180nm to 16nm process nodes. "Secafy's mission is to solve security challenges and contribute to the realization of a more secure and safe information society, by leveraging our unique 'hardware noise evaluation technology' and 'circuit design and implementation technology for hardware security.'" said Kazuki Monta, co-founder and CEO, Secafy. "Siemens' comprehensive EDA portfolio gives us the tools we need to advance our innovative hardware security research." "Secafy's selection of the Siemens portfolio of software for their full IC design flow is a significant win for us and demonstrates our leadership in Japan providing a cutting-edge design flow to pioneers engaged in innovative IC design," said Yukio Tsuchida, our vice president for Japan, Electronic Design Automation. "By adopting our comprehensive solution, Secafy is able to leverage the superior performance and capabilities of our tools for their security-focused LSI design work." #News #ICVerification

Curious about how to streamline your automotive IC design process while also meeting ISO 26262 requirements? 🤔 This video can help! Ann Keffer and Robert Serphillips will explore how our functional safety platform supports the full ISO 26262 lifecycle — from concept to validation. We also dive into how the Veloce Fault App enhances fault campaign efficiency and why it’s a game-changer for automotive IC designs. You can watch here 👉 https://sie.ag/4h35Yr #FunctionalSafety #Automotive #ISO26262 #Veloce

We are thrilled to announce the keynote presenters for the upcoming User2User North America conference, May 20th, 2025, in Santa Clara, CA. Joining Mike Ellow, Siemens EDA CEO, we are honored to have industry leaders Sandeep Bharathi and Mohit Gupta share their visionary insights. Sandeep Bharathi, Chief Development Officer at Marvell Technology, brings a wealth of experience and knowledge to the stage. His expertise in leading development strategies and driving innovation has positioned Marvell as a key player in the semiconductor industry. We look forward to hearing his perspectives on the multi-tiered complexity of AI infrastructure design and the opportunity for EDA solutions. Mohit Gupta, SVP & GM IP & Custom Silicon at Alphawave Semi, offers extensive experience in IP and custom silicon solutions. Mohit has been instrumental in advancing innovative technologies that are shaping the industry. His talk promises to provide valuable insights into the latest advancements and trends. Do not miss this opportunity for a day of technical sessions, networking with peers, and visionary keynote discussions. View the full agenda and register now to secure your spot - link is in the comments. We look forward to seeing you there!

As the semiconductor landscape evolves, hardware-assisted verification (HAV) is emerging as a must-have for software-driven validation—and nowhere is this more evident than in the RISC-V ecosystem. 🧑💻 Why is this the case? RISC-V architectures are built with software workloads in mind, not legacy constraints. Custom AI/ML accelerators demand agile, scalable, and workload-specific validation, making traditional verification methods insufficient. The challenge: Unlike standard CPU/GPU verification, RISC-V designs require aggressive validation of custom instruction sets and software stacks—a task that HAV platforms excel at. The solution: HAV enables high-speed, software-driven validation to ensure these architectures function flawlessly at scale. For custom accelerators, where verification speed and scalability are critical, HAV is the only path forward. Check out this LinkedIn article to dive deeper into why HAV is essential for the future of RISC-V and software-defined hardware architectures. #HardwareAssistedVerification #RISC_V #Semiconductors #SoftwareValidation 

Mike Ellow, Siemens EDA CEO, and team recently had the distinct honor of meeting with Prime Minister Nikol Pashinyan as well as Ruben Simonyan, Deputy Minister of High-Tech, to discuss strategic business and technology initiatives in Armenia. ⚙️ Conversations included the introduction of advanced laboratories in educational institutions and favorable business incentives designed to build an ecosystem for multinational technology companies to thrive in the Armenian market. Siemens EDA remains committed to the training of engineering students and enhancing educational infrastructure through joint programs with local universities. Additionally, we seek to expand and develop robust design teams, incorporating architects, QA specialists, and software engineers to drive high-impact product development. We believe that nurturing local talent and fostering innovation are key to delivering exceptional value to our customers and driving sustainable growth within the industry. We look forward to our continued partnership with Prime Minister Pashinyan and his team, and to implementing these strategic plans that contribute to the continued advancement of the high-tech sector in Armenia. #HighTech #Education #Innovation #Partnership

We’re excited to share great news for our small- and medium-sized customers in the electronics space – we’re growing to better support your needs! 📈 With today’s acquisition of DownStream Technologies, LLC, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design we strengthen Siemens’ PCB design portfolio. “The acquisition is a significant step for Siemens EDA in the mid-sized PCB market, offering DownStream’s customers improved time to market, quality, and cost efficiency”, said Mike Ellow, our CEO, Siemens EDA, Siemens Digital Industries Software. “Integrating DownStream Technologies enables Siemens EDA to provide the most comprehensive and advanced manufacturing data preparation solution, helping to ensure a smooth transition from design to production within a fully digitalized and scalable electronic systems design process.” “We’re excited to join forces with Siemens and bring our decades of expertise into their world-class ecosystem,” said Rick Almeida, founder, DownStream Technologies. “Together, we’ll provide a fully integrated solution with both breadth and depth that enables PCB designers to deliver designs to manufacturing with greater efficiency and confidence.” Visit the comments for more details 👇🏼 AJ Incorvaia #PCBDesign #ElectricalEngineering #PCB

The landscape of semiconductor design is undergoing a fundamental shift. System companies are now building their own custom accelerators, fueling a surge in AI/ML chip development. These are not traditional CPUs or GPUs but highly specialized ASICs designed for specific workloads. Why the shift? Control over roadmaps, ecosystem, and time-to-market is critical. 🕒 Who’s leading? From hyperscalers to tech giants, companies are designing their own silicon to optimize performance and efficiency. 🏢 What does this mean for verification? As AI/ML chip complexity skyrockets, verification must evolve. Hardware-assisted verification (HAV) – including emulation and prototyping – is becoming a must-have for ensuring performance, scalability, and power efficiency. As the demand for AI/ML workloads grows, so do the challenges in verification. The right combination of emulation, enterprise prototyping, and software prototyping is key to success. #Semiconductors #AI #ML #ASIC #Verification #HardwareVerification

Moore's Law is pushing us to think beyond 2D. 🧠 3D-IC technology opens incredible possibilities, but also introduces new verification challenges. Stacking dies creates complexities that traditional DRC, LVS, and PEX checks simply can't handle. That's where Calibre 3DSTACK steps in. This powerful solution provides the fast and accurate verification needed for today's intricate 2.5D and 3D-IC designs, helping designers pinpoint and resolve issues before physical assembly. Curious how it works? We've got you covered! Explore our latest blog post and video series via the link in our comments to understand how Calibre 3DSTACK ensures design reliability and enables seamless multi-die integration. #3DIC #AdvancedPackaging #ICDesign #VerificationTools #Semiconductor #Innovation

We're excited to share that we've been recognized once again for our commitment to innovation in electronic design automation: Catapult AI NN received the top prize in the Tools category at the Outstanding Innovation Awards held at embedded world Exhibition&Conference Europe. 🏆 The winning formula ⤵️ Catapult AI NN provides an automated pathway from neural networks to customized AI accelerators. AI algorithms are highly compute-intensive, often requiring acceleration to be practical, especially at the edge. Customized accelerators can outperform standard off-the-shelf components or intellectual property by more than ten times, delivering enhanced performance while also improving efficiency. Catapult AI NN combines cutting-edge synthesis technology with advancements in AI frameworks and neural networks. It automatically quantizes the network to achieve optimal power, performance and area, thereby reducing size, cost and energy consumption. What was once a development effort across various technology domains is now an automated process, enabling system designers to more effectively make use of the advantages of AI for their embedded products, thanks to Catapult AI NN. #HLS #HighLevelSynthesis #Catapult #AI #ML #EmbeddedWorld #EDA

Uncover Siemens' vision for the future of semiconductor tech with 3D IC Fundamentals!🔮 John McMillan shares insights into... ► 3D IC Fundamentals: Grasp the core concepts and advantages of 3D integrated circuit (IC) design over 2D. ► Design Challenges: Explore complexities of 3D ICs, including thermal management, interconnect density, and fabrication. ► Siemens' Solutions: Learn how the company's advanced software and platforms address these challenges for efficient and reliable 3D IC design and manufacturing. ► Real-World Impact: Dive into case studies showcasing how Siemens' 3D IC technologies are driving innovation and performance improvements across industries. ► Future Trends: Gain insights into upcoming 3D IC advancements, focusing on automation and emerging tech shaping the semiconductor landscape. Where? Watch below... (and check the comments for a link to more information)