HEXAspec

Congratulations to this year's first place winner of the TEX-E Prize, HEXAspec!

HEXAspec Takes 1st Place 🥇 🥇 at TEX-E Prize! It's pitch season for ambitious startups, and this week, HEXAspec returned to Houston to participate the CERAWeek and compete at the prestigious TEX-E Prize, showcasing the best startup spinouts from Texas universities. We are honored to take 1st place, shining a spotlight on the critical energy challenges posed by the next wave of massive data center deployments in Texas. A huge congratulations to Vitaly Sergeev from Nanoborne LLC and our Innovation Fellows Alexander Lathem and Lucas Eddy from Pattern Materials Graphene for securing 2nd and 3rd place, respectively, and taking home well-deserved prizes! A heartfelt thank you to all the organizers, student volunteers, and fellows and our mentor Humeyra B. ULUSOY EROL, Ph.D. at TEX-E for hosting such a fantastic event. We deeply appreciate the connections made with local industry sponsors, helping bridge the gap between university research and real-world impact to strengthen Texas’ innovation ecosystem. Special thanks to Liu Idea Lab for Innovation & Entrepreneurship and our invaluable partner Rice Innovation, Energy Tech Nexus—this is where our journey began and where our vision continues to grow. We're proud to carry forward the winning tradition of Rice University. We are HEXAspec. We help chips beat the heat. #HEXAspec #TEXEPrize #CERAWeek #StartupSuccess #SemiconductorInnovation #EnergyEfficiency

🚀 From Houston to Boston! Last week, HEXAspec traveled to the East Coast to compete in the prestigious MIT Climate and Energy Prize. Tianshu Zhai and Chen-Yang Lin pitched how we’re helping GPUs beat the heat, earning a spot in the finals this April! 🎉 Beyond the competition, we had the incredible opportunity to connect with fellow innovators tackling challenges from energy-efficient concrete and plastic recycling to nuclear power and hydrogen transportation. Through in-depth discussions, Q&A sessions, and feedback, we sharpened our pitch, highlighted the sustainability concerns of AI computing, and built meaningful connections with outstanding investors. A huge thank you to the student organizers, judges, and our amazing mentors—Chris Kong, Marc Davidson, and Kyle Judah—for their invaluable guidance in refining our pitch. 🙌 We can’t wait to take the stage in April and continue sharing our technology with the world. 🔥 We are HEXAspec. We help chips beat the heat. 🔥 #HEXAspec #MITCEP #DeepTech #ClimateTech #Semiconductors #AI #Sustainability #Entrepreneurship

🔥 AI's Explosive Growth Comes with a Power Price 🔥 AI is revolutionizing industries, but at what energy cost? According to Goldman Sachs, AI is projected to drive a 160%+ increase in data center power demand by 2030. That’s a staggering challenge for power grids, sustainability efforts, and the future of AI itself. The questions we need to ask: ⚡ Can AI become more energy-efficient without sacrificing performance? ⚡ How will power-hungry GPUs and accelerators impact global electricity demand? ⚡ What innovations—better cooling, advanced materials, or new chip architectures—will help sustain AI’s rapid growth? HEXAspec will be pitching at the MIT Climate and Energy Prize semifinal on March 6th–7th to discuss how advanced materials can improve semiconductor cooling efficiency and promote sustainable practices for data centers. https://lnkd.in/egirmRYA

🚨 Nvidia Faces Challenges with Blackwell AI Racks Amid Overheating Issues🚨 Nvidia’s recent launch of the highly anticipated “GPU Shield” NvLink72 system has hit a roadblock. Overheating issues and glitches with the Blackwell GB200 racks have led key customers—including Microsoft, Amazon, Google, and Meta—to delay orders. 💡 Key Takeaways: Major tech giants, with orders exceeding $10 billion each, are postponing purchases while waiting for improved versions or switching to older-generation Hopper chips. Microsoft planned to deploy 50,000 Blackwell chips in its Phoenix facility but reverted to Hopper at OpenAI’s request. Nvidia’s stock fell 4% following these reports and new U.S. export restrictions on AI chips. Despite these setbacks, Nvidia’s CEO, Jensen Huang, reassures investors that the company remains on track to exceed revenue targets for Blackwell chips this fiscal quarter. #AIHardware #Semiconductors #TechInnovation #ThermalManagement

HEXAspec: Making Waves in Houston and Beyond! 🚀 We’ve been in stealth mode recently while our founders took a well-deserved family trip. However, HEXAspec’s momentum hasn’t slowed down—we’ve been actively participating in Houston’s vibrant founder community and beyond. Here’s a look at what we’ve been up to: 🌟 September Highlights: Proudly joined the grand opening of Energy Tech Nexus as a member of their community, connecting with innovators shaping the future. Attended the Houston Energy and Climate Startup Week, a fantastic opportunity to meet local founders and explore Houston’s climate-forward solutions. 🌟 October Achievements: Honored to receive the One Small Step Grant (second cycle) and celebrated at their awards luncheon. Participated in Deeptech Day, hosted by Rice Innovation, where we pitched our vision to Houston-based VCs and investors. 🌟 November Inspiration: Attended the Houston InnovationMap Awards, celebrating alongside talented individuals and organizations driving progress and innovation in our community. It was inspiring to witness the brilliance of innovators shaping Houston’s entrepreneurial landscape. Last week, our co-founders visited the Micron Technology Center, exploring state-of-the-art chip manufacturing processes and cutting-edge fabs. We’re grateful for the opportunities to connect, learn, and share our mission to revolutionize semiconductor heat management with next-gen materials. Stay tuned—exciting updates are on the horizon! #HEXAspec #StartupJourney #InnovationEcosystem #HoustonTech

🚀 We’re entering the Angstrom Era of semiconductor manufacturing! 🚀 As technology continues to evolve, even nanometers aren’t small enough anymore for the next generation of chips. Leading-edge semiconductor manufacturing is stepping into the angstrom scale, and the U.S. is making bold moves to lead the way. The Biden-Harris Administration has awarded TSMC Arizona up to $6.6 billion in direct funding under the CHIPS Incentives Program to support its $65 billion investment in building three cutting-edge semiconductor fabs in Phoenix, Arizona. This initiative is a cornerstone of the broader effort to strengthen the U.S. semiconductor industry, create high-paying jobs, and secure the country’s leadership in advanced chip technology. The new fabs will manufacture leading-edge chips (such as A16 technology) used in critical sectors like AI, high-performance computing, 5G/6G smartphones, and autonomous vehicles. Source: U.S. Department of Commerce Press Release on Nov 15, 2024 https://lnkd.in/eHSbA8Di

🚀 Big News from Intel! 🚀 Intel has launched Fab 9 in New Mexico, part of a $3.5 billion investment in advanced semiconductor packaging. This state-of-the-art facility, featuring Intel's Foveros 3D packaging technology, enables flexible integration of multiple chips optimized for power, performance, and cost. Fab 9 enhances supply chain resilience and economies of scale, marking Intel's first U.S. site for mass production of 3D advanced packaging. It also creates a significant local economic impact in New Mexico. #Semiconductors #Innovation #Manufacturing #Intel #Technology https://lnkd.in/g9nqsTT2

🌿 Reducing Semiconductor Emissions: A Strategic Plan 🌿 Boston Consulting Group (BCG) has unveiled an insightful plan to address the environmental impact of the semiconductor industry. As demand for semiconductors surges, so does their carbon footprint, making it crucial to adopt sustainable practices. Key strategies highlighted include: 🔹 Optimizing Energy Efficiency: Implementing advanced manufacturing techniques to reduce energy consumption. 🔹 Adopting Renewable Energy: Transitioning to renewable energy sources to power semiconductor fabs. 🔹 Innovating Material Use: Developing and utilizing materials with a lower environmental impact. semiconductor industry can significantly reduce its emissions and contribute to a more sustainable future. HEXAspec is dedicated to developing next-generation packaging materials to help the semiconductor industry significantly reduce its emissions and contribute to a more sustainable future. #Sustainability #Semiconductors #GreenTech #ClimateAction #Innovation https://lnkd.in/gH8BKvHa

Teamwork is the most crucial factor for a successful startup. This week, HEXAspec members Chen-Yang Lin, Tianshu Zhai, Jing Zhang gathered in the Bay Area to connect with incredible industry mentors, investors, and lawyers. These interactions allowed us to dive deeper into our problem space, technology, and overall business strategy. Throughout this summer, HEXAspec will focus on enhancing our industrial-grade prototype and taking our technology to the next level. Exciting times ahead!