3D Systems Corporation

3D Systems is excited to announce several new solutions designed to create cost-effective and efficient additive manufacturing applications for our customers, including our Figure 4® 135 3D printer and Figure 4 Tough 75C FR Black material, a high-throughput, precise manufacturing solution for high mix low volume plastics. With extremely high out-of-box precision and very high stability, the Figure 4 135 solution is ideal for manufacturing industries where a process capability index (CpK) of at least 1.33 or above is required for critical processes. By applying this solution, manufacturers can eliminate tooling and inventory management, and reduce costs by multiple orders of magnitude. New innovations also include our new module for large-format EXT Titan Pellet Extrusion printers, allowing customers to achieve up to 60% improved process efficiency, in addition to the expansion of our QuickCast® Diamond™ solution now available for the PSLA 270 3D printer to produce easier to cast, complex master patterns more efficiently. Discover the full scope of these latest innovations in our full press release, and see them in-person at Rapid + TCT 2025 starting April 8 with our team in booth #3201: https://lnkd.in/g34cVCQA

Join Dr. Jeffrey Graves, President and CEO of 3D Systems and Patrick Treacy, Founder and CEO of Onkos Surgical at Rapid + TCT 2025 to hear how 3D printing is disrupting traditional implant manufacturing for healthcare. By enabling patient-specific life-changing solutions to address the most extreme medical challenges, discover how innovation is transforming healthcare and patients’ lives in this session of the Executive Perspectives Keynote Series. Don't miss this exclusive opportunity on April 9, 8:30 a.m. EDT at on the Main Stage. Learn more here: https://lnkd.in/gPP-ecPN

In highly regulated industries, the Technical Data Package (TDP) is the authoritative technical description of an item, ensuring requirements around acquisition, production, inspection, engineering and logistics are met. At 3D Systems, we're streamlining TDP creation — giving engineering, quality, and manufacturing teams a faster, smarter way to deliver complete, compliant data packages for AM applications. The overall workflow is created, validated, and documented in a production environment, resulting in a de-risked process for our customers and their supply chain to adopt and scale. Meet with our team at RAPID + TCT 2025 in booth #3201 to learn more about our Rapid #TDP and the integrated technology that supports this workflow: https://lnkd.in/gPP-ecPN

Productivity and precision are key when driving high performance and platform development efficiencies in motorsports and transportation. Meet with our team during RAPID + TCT to discover the workflows that enable Motorsports and Transportation applications such as 3D-printed composite tooling, parts to improve component performance at extreme temperatures with rapid iterations or windtunnel parts with integrated pressure tappings produced with our aerodynamic solution for multiple iterations in parallel: https://lnkd.in/gaZ5bQKt Find our team in Booth #3201 starting April 8 to take your innovations to road and track faster than ever. Schedule time to meet with us ahead of #Rapid2025: https://lnkd.in/gPP-ecPN

Go beyond the limits of thermal management with our Application Innovation Group (AIG) experts, developing optimized components such as this next generation wafer table that can only be produced using our metal 3D printing solutions. Demonstrated in the heat map shown here, optimally design, rapidly iterate, and manufacture cold plates with complex parametric fluid flow pattern that accelerates fluid path evenly to increase cooling efficiency, thus improving high quality semiconductor chips yield within each wafer. See impressive applications and discover how we are empowering next gen semiconductor architecture and computing breakthroughs from design to post-process during Rapid + TCT 2025: https://lnkd.in/gPP-ecPN Interested in learning more ahead of Rapid + TCT 2025 about how our additive manufacturing solutions help maximize heat transfer efficiency and improve semiconductor manufacturing equipment throughput and accuracy with this next gen wafer table? Watch our latest webinar: https://lnkd.in/gff-Eb85

In industries like 𝗮𝗲𝗿𝗼𝘀𝗽𝗮𝗰𝗲, 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿, 𝗮𝗻𝗱 𝗱𝗲𝗳𝗲𝗻𝘀𝗲, the stakes are high — and the margin for error is zero. At AMUG 2025, meet the Application Innovation Engineers behind real-world transformations where additive isn’t just an R&D tool — it’s a competitive advantage. Learn how we helped customers like Airbus and Wilting: ● Slash lead times by 60-90% ● Deliver multi-part consolidation for performance gains ● De-risk and scale mission-critical production Stop by our booth at AMUG 2025 and walk away with more than ideas — but a strategy guiding you to smarter, faster, leaner manufacturing practices: https://lnkd.in/g9fB5JEM

3D Systems is excited to support the Purdue Space Program: A SEDS Chapter, Indiana's premier collegiate liquid rocketry team, with their 3D printed fuel injector made from LaserForm Ni718. The students at PSP Liquids have gained real world experience cooling rocket parts to cryogenic temperatures prior to firing the rocket's engine. After successfully static firing the engine, the team will soon be taking their rocket out to the Mojave Desert for launch at the F.A.R. Launch Complex. Discover how 3D Systems' Application Innovation Group delivers a Rapid Technical Data Package from concept to derisked production process: https://lnkd.in/gtwTada5 See this part and meet the PSP team in-person at Rapid 2025 in our 3D Systems booth: https://lnkd.in/gPP-ecPN

Metal 3D printing is combining innovative materials with state-of-the-art technology to create optimized components, not possible to produce with traditional manufacturing. Dive into a recent use case with 3D Systems, Diabatix, ElmorLabs Ltd and SkatterBencher to deliver the world’s most powerful liquid nitrogen heatsink for extreme CPU cooling. Made of commercially pure oxygen-free copper for the thermal conductivity of 290 W/mK, discover more about the workflow behind this impressive application in Digital Engineering Magazine: https://lnkd.in/eGXVU5pR

For the production of large parts, 3D Systems' EXT Titan Pellet technology is helping our customers save on material costs and boost throughput while improving overall quality. Dive into the advantages and industrial applications of pellet extrusion AM technology with Rahul Kasat in our latest contribution to SME Magazine: https://lnkd.in/gGDGQrg8

Thank you those that met with our team at AM Forum this week!  Frank Cremer and our metal 3D printing specialist, Iñigo Marco (PhD, MSE, BID), were live on-site connecting with attendees and providing a holistic view of our workflows and integrated solutions. Learn more about combining software, 3D printers, and materials with the expertise of the specialists from our Applications Innovation Group (AIG): https://lnkd.in/gQsmZeSa