LightSpeed Photonics

The future of high-speed data communication is being reshaped by advancements in optical I/O, particularly with the rise of co-packaged optics (CPO). This approach integrates optics directly into the chip’s package, promising unparalleled performance. While we fully support this innovation and believe it will play a critical role in long-range and high-density applications like switches, we also recognize that not all use cases—especially short to medium-range communication—require such an expensive solution. Enter LightSpeed’s near-packaged optics approach. 📔 Instead of redesigning the entire chip architecture package around the interconnect, we’ve developed a frugal, solderable component that sits near the chip, delivering many of the same benefits with the existing tech & standard packaging without the complexity or high cost. Here’s why this matters: ✅ Proven Reliability: Leverages off-the-shelf components with established performance. ✅ Faster Time-to-Market: No need to reinvent assembly processes—scalability is built-in with surface mountable component at the board level. ✅ Lower Barrier to Adoption: Chipmakers and OEMs can integrate high bandwidth optical I/O without a full overhaul. This, we believe is a better alternative to CPO for most of edge chips and AICs ensuring customers can adopt cost-effective multimode optical I/O today. Want to see the difference in action? ⚡ Visit us at OFC Booth #6376 to explore live demos and quantify the benefits firsthand. #OFC2025 #OpticalInterconnects #AI #HPC #DataCenters #TechInnovation Rohin Y | Ramana V Pamidighantam | Sindhu Padmini | PHANI BHUSHAN NALLAJANULA | Devan Iyer |

The Interconnect Bottleneck: Why Data Centers Need a New Approach ? As AI/ML workloads continue to scale, data centers are undergoing a rapid transformation. Processor sizes have increased 5x since 2015, pushing thermal and physical limits. With multi-die architectures and chiplet integration becoming the norm, one major challenge stands in the way: high-speed, efficient interconnects. Modern data centers rely on racked servers interconnected by optical fiber cables to manage ever-growing AI/ML workloads ( Image below ). Inside each server, compute and network cards drive processing, but a critical bottleneck remains—the pluggable transceivers (QSFP) that convert optical signals to electrical. This adds latency, power consumption, and scalability constraints, making efficient interconnect solutions more urgent than ever. The Problem: Traditional Interconnects Can't Keep Up 🔹 Bandwidth Explosion – CAGR 29% (2017-2022), with 3000 TWh power demand expected by 2030. 🔹 Interconnects drain 10-15% of total power, potentially growing to 40% for AI/HPC. 🔹 Electrical interconnects struggle at higher data rates, making optical solutions a necessity. Hence the Future is Optical 💡 To solve these challenges, interconnects must evolve—reducing power consumption, enabling seamless high-speed communication, and bringing optical links closer to processors. 📢 Join us at OFC 2025 (Booth #6376) as we launch the next generation interconnects built to redefine data center connectivity. #OFC2025 #OpticalInterconnects #AI #HPC #DataCenters #TechInnovation Rohin Y | Ramana V Pamidighantam | Sindhu Padmini | PHANI BHUSHAN NALLAJANULA | Devan Iyer |